Search Results - IC editorial.

Guest Editorial Special Issue on Power Semiconductor Devices and Smart Power IC Technologies.

Authors: Ng, Wai Tung Udrea, Florin Omura, Ichiro et al.

Source: IEEE Transactions on Electron Devices; Mar2017, Vol. 64 Issue 3, p654-658, 5p

Timing Analysis and Optimization for DSM IC--Guest Editorial.

Authors: Chen, Chien-In Henry¹

Source: VLSI Design; Nov2002, Vol. 15 Issue 3, p555-556, 2p

Editorial board interlocking in knowledge management and intellectual capital research field.

Authors: Teixeira, Eduardo Kunzel Oliveira, Mirian

Source: Scientometrics; Dec2018, Vol. 117 Issue 3, p1853-1869, 17p

Guest Editorial: Special Issue on Transdisciplinary Artificial Intelligence.

Authors: D'Auria, Daniela Persia, Fabio

Source: International Journal of Semantic Computing; Sep2024, Vol. 18 Issue 3, p301-303, 3p

A Microwave Journey, Part II: the 1960s.

Authors: Vye, David

Source: Microwave Journal; August 2008, Vol. 51 Issue 8, p106-119, 5p

PV and IC industries converge.

Source: Solid State Technology; August 2008, Vol. 51 Issue 8, p12-12, 1p

Retraction Note: Soft computing-based edge-enhanced dominant peak and discrete tchebichef extraction for image segmentation and classification using DCML-IC.

Authors: Ramalakshmi, K. SrinivasaRaghavan, V.

Source: Soft Computing - A Fusion of Foundations, Methodologies & Applications; 2024 Suppl 1, Vol. 28, p105-105, 1p

Can Semiconductor IC Equipment Survive without Thermal Spray Coatings?

Authors: Shih, Hong

Source: Advanced Materials & Processes; May 2010, Vol. 168 Issue 5, p42-42, 1p

Guest Editorial.

Authors: Bozzi, Maurizio Wu, Ke

Source: IEEE Transactions on Microwave Theory & Techniques; Jun2018, Vol. 66 Issue 6, p2915-2919, 5p

Guest editorial: special issue on big data for effective disaster management (In Memorial of Tao Li).

Authors: Song, Xuan Guo, Song Wang, Haizhong

Source: World Wide Web; Sep2019, Vol. 22 Issue 5, p1889-1891, 3p

The Eye of the Beholder: Whence IC?

Authors: Douglis, Fred¹, fdouglis@computer.org

Source: IEEE Internet Computing; May-Jun2008, Vol. 12 Issue 3, p3-5, 3p

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Guest Editorial Special Section on Hardware Security and Trust.

Authors: Karri, Ramesh Koushanfar, Farinaz Sinanoglu, Ozgur et al.

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems; Jun2015, Vol. 34 Issue 6, p873-874, 2p

Guest Editorial Special Section on the IEEE International Conference on Microelectronic Test Structures.

Authors: Mita, Yoshio Smith, Stewart

Source: IEEE Transactions on Semiconductor Manufacturing; Aug2017, Vol. 30 Issue 3, p190-191, 2p

Where is the BOM in IC design?

Authors: Chatterjee, Pallab

Source: EDN; July 19 2007, Vol. 52 Issue 15, p38-38, 1p

China vs. India IC Production Trends.

Source: Semiconductor International; March 2007, Vol. 30 Issue 3, p110-110, 1p

Editorial.

Authors: Hartnagel, H. Ho-Chung Huang

Source: International Journal of Electronics; Apr85, Vol. 58 Issue 4, p529, 2p

Guest Editorial.

Authors: Xie, Yuan Loh, Gabriel

Source: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems; Apr2013, Vol. 32 Issue 4, p485-486, 2p

Editorial Year-in-Review.

Authors: Liu, Tsu-Jae King

Source: IEEE Electron Device Letters; Mar2017, Vol. 38 Issue 3, p297-297, 1p

New Associate Editors.

Authors: Craninckx, Jan¹

Source: IEEE Journal of Solid-State Circuits; Jun2019, Vol. 54 Issue 6, p1515-1516, 2p