Search Results - "Ball grid array technology"

A Genetic Algorithm-Based Optimization Method for Ordered Escape Routing in BGA PCBs Under Non-Crossing and Single-Capacity Constraints.

Authors: Chang, Chun-Kai Cheng, Dun-Wei

Source: Applied Sciences (2076-3417); Feb2026, Vol. 16 Issue 4, p2010, 29p

Interpretable data-driven framework for life prediction of homogenous lead-free solder joints in ball grid array packages.

Authors: Qasaimeh, Qais Liu, Jia Silva, Daniel F. et al.

Source: Journal of Intelligent Manufacturing; Feb2026, Vol. 37 Issue 2, p659-677, 19p

Adaptive transformer-augmented network for multi-type defect detection in ball grid array assemblies.

Authors: Jiao, Zhiqiang Zhang, Yanhan Wang, Min et al.

Source: Journal of Intelligent Manufacturing. May2026, p1-19. 19p.

X-RAY INSPECTION of Ball Grid Array Solder Joints.

Authors: BELL, NASH¹

Source: SMT007 Magazine. Jul2026, Vol. 41 Issue 7, p58-63. 4p.

An industrial X-ray inspection framework for SMT solder bridge detection in BGA assemblies.

Authors: Zhou, Xiran¹ (AUTHOR) xfz5288@psu.edu

Source: International Journal of Advanced Manufacturing Technology. Apr2026, Vol. 143 Issue 11/12, p7373-7378. 6p.

Subjects: Deep learning, Ball grid array technology, Manufacturing industries, Object recognition (Computer vision), Imperfection, X-ray detection, Engineering inspection

Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.

Authors: Ma, Shuai Sun, Yi Nan, Yifei et al.

Source: Journal of Materials Science: Materials in Electronics; May2026, Vol. 37 Issue 13, p1-28, 28p

Crack Severity Analysis in Predicting Solder Joint Reliability for Mirrored Flip Chip Ball Grid Array Packages.

Authors: Ilias, Muhammad Nizam Bakar, Maria Abu Jalar, Azman et al.

Source: Journal of Failure Analysis & Prevention. Aug2025, Vol. 25 Issue 4, p1946-1959. 14p.

Subjects: Solder joints, Ball grid array technology, Thickness measurement, Electronic equipment, Reliability in engineering, Thermocycling, Failure analysis, Fracture strength

Solving the Toughest BGA Challenges in Electronics.

Authors: Bell, Nash^1,2

Source: SMT007 Magazine. Jul2025, Vol. 40 Issue 7, p34-40. 5p.

Revamp Your Components With BGA Reballing.

Authors: Bell, Nash¹

Source: SMT007 Magazine. Oct2025, Vol. 40 Issue 10, p50-54. 3p.

Measurement Capability of Laser Ultrasonic Inspection System for Evaluation of Ball-Grid Array Package Solder Balls.

Authors: Reddy, Vishnu V. B. Williamson, Jaimal Sitaraman, Suresh K.

Source: Journal of Microelectronic & Electronic Packaging. 2021, Vol. 18 Issue 4, p183-189. 7p.

Subjects: Ball grid array technology, Ultrasonic waves, Microelectronic packaging, Nondestructive testing, Data analysis

Evaluating the selection process for optical sensor system configurations used in surface metrology applications.

Authors: Sokolov, Alexandr M. Simpson, Travis Ahmed, Ifaz

Source: Measurement (02632241). Jun2026, Vol. 280, pN.PAG-N.PAG. 1p.

Subjects: Interferometry, Ball grid array technology, Confocal microscopy, Optical sensors, Surface roughness measurement, Substrates (Materials science), Microfabrication

Thermo–vibration coupled reliability methodology of BGA solder joints considering the preload effect of heat sink bolts.

Authors: Chen, Yifan Wei, Xue Huang, Cai et al.

Source: Microelectronics Reliability. Jun2026, Vol. 181, pN.PAG-N.PAG. 1p.

Subjects: Lead-free solder, Ball grid array technology, Mechanical loads, Fasteners, Finite element method, Fatigue limit, Fatigue life

CTE match of copper foil and build-up film/core board in FCBGA substrate reduces warpage.

Authors: Wong, Winston Chiang, S. T. Huang, Jason C. S. et al.

Source: Scientific Reports. 11/21/2025, Vol. 15 Issue 1, p1-13. 13p.

Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations.

Authors: Kim, Dongjin Han, Seonghui Baik, Junha et al.

Source: Microelectronics Reliability. Mar2026, Vol. 178, pN.PAG-N.PAG. 1p.

Subjects: Solder & soldering, Ball grid array technology, Metal compounds, Energy dissipation, Thermocycling, Thermal shock

Ball grid array solder joints thermal profile prediction and recipe optimization with physics-informed neural network.

Authors: Zhang, Zhenxuan Li, Yuanyuan Yoon, Sang Won et al.

Source: Microelectronics Reliability; Jun2026, Vol. 181, pN.PAG-N.PAG, 1p

The Evolution of IMCs in Single Crystal Sn3.0Ag0.5Cu and Sn3.0Ag3.0Bi3.0In BGA Solder Joints with Au/Ni/Cu Pads Under Current Stressing.

Authors: Tian, Yu Wang, Yishu Guo, Fu et al.

Source: Journal of Electronic Materials. May2019, Vol. 48 Issue 5, p2770-2779. 10p. 4 Color Photographs, 3 Diagrams, 1 Chart, 4 Graphs.

Subjects: Intermetallic compounds, Ball grid array technology, Solder joints, Electron backscattering, Tin

Effects of System Design on Fatigue Life of Solder Joints in BGA Packages Under Vibration at Random Frequencies.

Authors: Samavatian, Majid Ilyashenko, Lubov K. Surendar, A. et al.

Source: Journal of Electronic Materials. Nov2018, Vol. 47 Issue 11, p6781-6790. 10p. 4 Diagrams, 3 Charts, 7 Graphs.

Subjects: Solder joints, Ball grid array technology, Fatigue life, Electronic packaging, Vibration (Mechanics)

Head-on-Pillow Defect Detection: X-Ray Inspection Limitations.

Authors: Bruno, Lars Gustafson, Benny

Source: Journal of Microelectronic & Electronic Packaging. Apr2019, Vol. 16 Issue 2, p91-102. 12p.

Subjects: Ball grid array technology, Solder joints, System-in-a-package, Solder pastes, Halides

VMM - An ASIC for Micropattern Detectors.

Authors: Iakovidis, George¹ giakovidis@bnl.gov

Source: EPJ Web of Conferences. 2018, Vol. 174, p1-4. 4p.

Size effect on shear performance of microscale ball grid array structure Cu/Sn-3.0Ag-0.5Cu/Cu solder joints under current stressing.

Authors: Wang, Bo Ke, Zhanglong Chen, Zimeng et al.

Source: Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 2, p156-172. 17p.

Subjects: Shear strength, Solder joints, Ball grid array technology, Mechanical behavior of materials, Finite element method, Intermetallic compounds, Fracture mechanics