Search Results - "Burchett, S. N."

Role of anisotropic behaviour of Sn on thermomechanical fatigue and fracture of Sn-based solder joints under thermal excursions.

Authors: SUBRAMANIAN, K. N.¹ subraman@egr.msu.edu

Source: Fatigue & Fracture of Engineering Materials & Structures. May2007, Vol. 30 Issue 5, p420-431. 12p. 14 Diagrams, 2 Charts, 5 Graphs.

Modelling the curing process in particle-filled electro-active polymers with a dispersion anisotropy.

Authors: Hossain, Mokarram¹ (AUTHOR) mokarram.hossain@swansea.ac.uk

Source: Continuum Mechanics & Thermodynamics. Mar2020, Vol. 32 Issue 2, p351-367. 17p.

Investigation of Stress-Strain Constitutive Behavior of Intermetallic Alloys.

Authors: Cheng, H. C. Hu, H. C. Hong, R. Y. et al.

Source: Journal of Mechanics. Jun2018, Vol. 34 Issue 3, p349-361. 13p.

Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer.

Authors: Chien-Hsun Chuang Yan-Cheng Lin Che-Wei Lin

Source: Metals (2075-4701); Apr2016, Vol. 6 Issue 4, p92, 10p

Intermediate temperature joining of dissimilar metals.

Authors: Hosking, F. M. Stephens, J. J. Rejent, J. A.

Source: Welding Journal; April 1999, Vol. 78 Issue 4, p127s-136s, 10p

Processing And Fabrication Of Advanced Materials Viii

Authors: Freddy Yin Chiang Boey K A Khor Tirumalai S Srivatsan et al.

Resource Type: eBook.

Subjects: Mechanical alloying--Congresses, Ceramic materials--Congresses, Metallic composites--Congresses

Categories: TECHNOLOGY & ENGINEERING / Mechanical