Search Results - "Computer cooling"

Cooling technology options for HPC.

Authors: ROE, ROBERT

Source: Scientific Computing World. Feb/Mar2019, Issue 164, p8-11. 4p.

Subjects: High performance computing, Computer cooling, Heat exchangers, Evaporative cooling, Air

Thermal aware workload placement with task-temperature profiles in a data center.

Authors: Wang, Lizhe Khan, Samee Dayal, Jai

Source: Journal of Supercomputing; Sep2012, Vol. 61 Issue 3, p780-803, 24p

Keeping Cool is Mission Critical.

Authors: Sasikala, Seetha¹ maildqindia@cybermedia.co.in

Source: Dataquest. 10/31/2013, Vol. 31 Issue 20, p52-56. 5p.

Bath your computer in baby oil.

Authors: Wilkie, Tom

Source: Scientific Computing World. Jun/Jul2012, Issue 124, p30-34. 3p.

Subjects: Fats & oils, Computer cooling, High performance computing, Cray computers, Cray, Seymour, 1925-1996, Iceotope (Company), Barrington, Richard, Computational fluid dynamics

BATTLING THE ZOMBIE SERVERS.

Authors: Josephs, Nathaniel^1,2

Source: Mission Critical; Jan/Feb2017, Vol. 10 Issue 1, p38-40, 3p

COOLING UPGRADES HAVE NEVER BEEN HOTTER.

Authors: Silnes, Mark^1,2

Source: Mission Critical; Jan/Feb2017, Vol. 10 Issue 1, p26-30, 3p

Efficacy of a novel liquid block working with a nanofluid containing graphene nanoplatelets decorated with silver nanoparticles compared with conventional CPU coolers.

Authors: Bahiraei, Mehdi Heshmatian, Saeed

Source: Applied Thermal Engineering. Dec2017, Vol. 127, p1233-1245. 13p.

Redesigning the Data Center.

Authors: Mone, Gregory

Source: Communications of the ACM; Oct2012, Vol. 55 Issue 10, p14-16, 3p, 1 Color Photograph

Overclock Your Graphics Board.

Authors: CHIAPPETTA, MARCO

Source: PCWorld; Jun2012, Vol. 30 Issue 6, p84-86, 3p, 2 Color Photographs, 1 Chart

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit.

Authors: Ellsworth Jr., Michael J. Zoodsma, Randy J. Caseio, Frank et al.

Source: Journal of Electronic Packaging. Dec2014, Vol. 136 Issue 4, p1-9. 9p.

Subjects: Thermoelectric cooling, Computer cooling, Electronic packaging, Chip scale packaging, Supercomputers

On the thermal cooling of central processing unit of the PCs with vapor chamber

Authors: Naphon, Paisarn Wongwises, Somchai Wiriyasart, Songkran

Source: International Communications in Heat & Mass Transfer. Oct2012, Vol. 39 Issue 8, p1165-1168. 4p.

Subjects: Central processing units, Computer cooling, Personal computers, Experiments, Working fluids, Temperature effect, Energy consumption

Water walking with Ryzen.

Authors: Storey, Zak

Source: APC (Future Publishing Ltd.); Oct2018, Issue 459, p86-90, 5p, 12 Color Photographs, 2 Charts

Modular design increases energy efficiency.

Authors: Roe, Robert

Source: Scientific Computing World; Feb/Mar2019, Issue 164, p14-15, 2p

Motor Bearing Fault Detection Using Spectral Kurtosis-Based Feature Extraction Coupled With K-Nearest Neighbor Distance Analysis.

Authors: Tian, Jing Morillo, Carlos Azarian, Michael H. et al.

Source: IEEE Transactions on Industrial Electronics; Mar2016, Vol. 63 Issue 3, p1793-1803, 11p

Power dissipation in information processing.

Authors: Keyes, R. W.

Source: Science; 15 May 1970, Vol. 168, p796-801, 6p

Keeping it cool.

Authors: Harlen, Beth

Source: Scientific Computing World. Jun/Jul2013, Issue 130, p38-39. 2p.

Subjects: Computer cooling, Data libraries, Server farms (Computer network management), Giangrosso, Patrick, Coolcentric (Company)

Chapter 1: Introduction: Survey Overview and Outline.

Authors: Sabry, Mohamed M. Atienza, David

Source: Foundations & Trends in Electronic Design Automation. 2014, Vol. 8 Issue 2, p131-133. 3p.

Subjects: Multicore processors, Computer cooling, Performance of multiprocessors, Thermal management (Electronic packaging), Three-dimensional display systems

HOW MUCH WATER DO DATA CENTERS DRINK?

Authors: Jenkins, Richard¹

Source: Mission Critical; Jan/Feb2017, Vol. 10 Issue 1, p36-37, 2p

Chapter 4: Temperature-Aware Runtime Management for 3D MPSoCs: Reactive Versus Proactive Management Schemes.

Authors: Sabry, Mohamed M. Atienza, David

Source: Foundations & Trends in Electronic Design Automation; 2014, Vol. 8 Issue 2, p171-176, 6p

Chapter 4: Temperature-Aware Runtime Management for 3D MPSoCs: Centralized Versus Decentralized Management Schemes.

Authors: Sabry, Mohamed M. Atienza, David

Source: Foundations & Trends in Electronic Design Automation; 2014, Vol. 8 Issue 2, p166-171, 6p