Search Results - "Copper plating"

Interface‐Controlled Reliability of HDI Microvias: A Critical Review and Perspective.

Authors: Kamble, Vikram G. Habib, Mohammad Rezwan

Source: Advances in Materials Science & Engineering. 5/19/2026, Vol. 2026, p1-14. 14p.

Subjects: Copper plating, Fabrication (Manufacturing), Printed circuits industry, Prediction models, Nondestructive testing, Reliability in engineering, Deterioration of materials

Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects.

Authors: Ju, Fan Pu, Jie Wang, Yuebing et al.

Source: Soldering & Surface Mount Technology. 2026, Vol. 38 Issue 4, p308-318. 11p.

CU ELECTRODEPOSITION ON POLYPYRROLE PRECOAT FOR THE METALLIZATION OF PRINTED CIRCUIT BOARDS.

Authors: JUNHUI, HU HUI, Y. XIAOGE, CH. et al.

Source: Archives of Metallurgy & Materials. 2025, Vol. 70 Issue 4, p1905-1912. 8p.

Subjects: Copper plating, Polypyrrole, Metalation, Circuit board manufacturing, Electroplating, Electrochemical experiments, Green technology, Printed circuits industry

Unraveling the Synergistic Mechanism and Performance Impact of Tetrazolium Violet: Towards Void-Free Copper Electroplating Filling for Ultra-High Aspect Ratio Through-Holes.

Authors: Shi, Zongyuan Jin, Lei Bao, Rongan et al.

Source: Journal of The Electrochemical Society. 2026, Vol. 173 Issue 10, p1-10. 10p.

Subjects: Tetrazolium, Copper plating, Molecular interactions, Circuit board manufacturing, Electrochemical analysis, Ab-initio calculations

DECENTRALIZED GOVERNANCE IN THE CHOLA EMPIRE: A STUDY ON LOCAL ADMINISTRATION AND ITS IMPACT ON SOUTH INDIAN SOCIETY.

Authors: CHITRA, Ms. G. ABBAS, Dr. R.

Source: Cuestiones de Fisioterapia. 2025, Vol. 54 Issue 3, p2043-2052. 10p.

Numerical Simulation of Contact and Wear Between Deformed Mold and Solidified Shell Based on Archard Model.

Authors: Zhang, Hang Wang, Weiling Zhao, Chenxu et al.

Source: Metallurgical & Materials Transactions. Part B; Aug2025, Vol. 56 Issue 4, p3774-3792, 19p

Early photograph of a First Lady.

Source: Week Junior (US Edition). 7/26/2024, Vol. 5 Issue 223, p5-5. 1/9p. 1 Black and White Photograph.

Improved Uniformity in Glass TSV Filling by Asymmetric Dwell Pulsed Potential Deposition.

Authors: Kim, Youjung Shim, Eunsoo Park, Ji Young et al.

Source: Journal of The Electrochemical Society. 2026, Vol. 173 Issue 7, p1-11. 11p.

Subjects: Copper plating, Electroplating, Cyclic voltammetry, Additives, Electrochemical analysis, Copper sulfate

An Exploration of Manufacturing Technology to Refine the Grain Size and Improve the Properties of Welded TA1 Titanium Plates for Cathode Rollers.

Authors: Qi, Lin Hu, Jing Wang, Dayue et al.

Source: Coatings (2079-6412); Jun2025, Vol. 15 Issue 6, p687, 17p

An Experimental Optimization of Solar Dryer Employing Phase Change Material for Potato Slices Using Variance Analysis.

Authors: Mamulkar, C. A. Ikhar, S. R.

Source: International Journal of Thermodynamics; Jun2025, Vol. 28 Issue 2, p103-114, 12p

A Hybrid Approach to Longitudinal Crack Detection with Computer Vision, Image Processing, and Machine Learning.

Authors: Wang, Yan-yu Wang, Qi-can Cheng, Yong-hui et al.

Source: Metallurgical & Materials Transactions. Part B; Jun2025, Vol. 56 Issue 3, p3049-3064, 16p

Metalworking Influence on the Corrosion Behaviour of Sterling Silver and Silver Plated Copper.

Authors: Tobisch, Valentina Ljubić Selimović, Albina Kautek, Wolfgang

Source: Studies in Conservation. May2025, Vol. 70 Issue 4, p296-305. 10p.

Connecting Stories: Investigations of a Seventeenth-century Mercator Hand-painted Map.

Authors: Ratoiu, Lucian-Cristian Ghervase, Luminița

Source: Studies in Conservation. May2025, Vol. 70 Issue 4, p317-331. 15p.

13Cr11Ni2W2MoV 不锈钢定位螺栓腐蚀 断裂原因分析. (Chinese)

Authors: 詹平 曹江 李欣 et al.

Source: Metal Working (1674-165X); 2026, Issue 6, p119-122, 4p

Submicron‐Order Film Thickness Measurement of Nonmagnetic Metal Thin Films Formed on Ferromagnetic Metal Substrates.

Authors: Matsuura, Fumiaki Enoki, Shigemi Sato, Mitsuhide et al.

Source: Electronics & Communications in Japan; Jun2026, Vol. 109 Issue 2, p3-13, 11p

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators.

Authors: Percoco, Gianluca Larovere, Nicola Zagaria, Antonio et al.

Source: Advanced Materials Technologies; Jun2026, Vol. 11 Issue 11, p1-17, 17p

HOW DOES MAGIC HAPPEN? ¿CÓMO SUCEDE LA MAGIA?

Authors: JIMÉNEZ, ANA MARÍA (AUTHOR)

Source: Metalsmith. 2025, Vol. 45 Issue 2, p34-45. 12p. 18 Color Photographs.

Subjects: Acoustics, Copper plating, Vocal music, Copper, Stone

铜精炼过程中镍元素的迁移转化-有效控制 及综合回收.

Alternate Title: The Migration-Control and Recovery of Nickel in Copper Refining Process.

Authors: 沐亚玲 曾文斌 秦树辰 et al.

Source: Nonferrous Metals. Apr2025, Vol. 15 Issue 4, p607-613. 7p.

Advancing self‐lubricating technology: Selective laser sintering molding assisted development of copper‐based polytetrafluoroethylene /graphite composites.

Authors: Wu, Haihua Gao, Aodong Zhang, Hualong et al.

Source: Polymer Composites. 2/20/2025, Vol. 46 Issue 3, p2847-2860. 14p.

Effects of Tool Structure and Process Parameters in Friction Stir Welding on the Temperature and Mechanical Properties of Dissimilar Copper–Aluminium Welded Joints.

Authors: Zhang, Yuxun Shi, Jinlong Liao, Guofang et al.

Source: Metals (2075-4701); Feb2025, Vol. 15 Issue 2, p193, 26p