Search Results - "Electronic packaging"

Synthesis and Characterization of CaO-Al2O3-SiO2 Glass/Al2O3 Composites via Sol-Gel Method for Electronic Packaging Applications.

Authors: Dinler, Ayşe Nur Kırsever, Derya

Source: Sakarya University Journal of Science (SAUJS) / Sakarya Üniversitesi Fen Bilimleri Enstitüsü Dergisi. Jun2026, Vol. 30 Issue 3, p406-419. 14p.

A 3D Vertically-Integrated Wideband Filter Antenna for X-Band Applications.

Authors: Fang, Tao Tang, Tao Zhao, Xiangyan et al.

Source: Progress in Electromagnetics Research C; 2026, Vol. 169, p106-114, 9p

A Lifetime Consumption Model for Combined Creep and Fatigue Loading of Aluminum Bonding Wires.

Authors: Altenbach, Holm Moers, Cassandra Dresbach, Christian

Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 12, p6058, 20p

Source: Gentherm Inc. MarketLine Company Profile. 3/12/2026, p1-28. 28p.

Subject Terms: *Automobile industry, *Thermal management (Electronic packaging)

Geographic Terms: United States

Company/Entity: Gentherm Inc.

Source: Pentair plc (formerly known as Pentair Ltd.) MarketLine Company Profile. 3/9/2026, p1-27. 27p.

Subject Terms: *Manufacturing industries, *Thermal management (Electronic packaging)

Geographic Terms: Switzerland

Company/Entity: Pentair Inc. 006451249 PNR

Machine learning-driven multi-objective parameter optimization for sustainable, efficient, and high-quality ultrasonic wire bonding.

Authors: Buchner, Christoph Riedle, Benjamin Krauß, Jonas et al.

Source: Journal of Intelligent Manufacturing. Apr2026, Vol. 37 Issue 4, p1681-1699. 19p.

X-Ray Characterization of Semiconductor Materials and Advanced Packaging: A Perspective on Multidimensional Structural Analysis.

Authors: Jiang, Yumeng Zhang, Zhenwei An, Zhongyi et al.

Source: Crystals (2073-4352); Apr2026, Vol. 16 Issue 4, p265, 33p

Ni Thick Films with Compact Structure and Strong Adhesion Prepared with H 2 -Assitant RF Magnetron Sputtering at High Deposition Rate.

Authors: Bilal, Umar Li, Yangping Rana, Fizza et al.

Source: Coatings (2079-6412); Mar2026, Vol. 16 Issue 3, p279, 18p

Prediction of Activity of Au-Sn-Based Lead-Free Solder Using Modified Molecular Interaction Volume Model.

Authors: Wu, Hai Chen, Liangliang Zhu, Liguo et al.

Source: Metals (2075-4701); Mar2026, Vol. 16 Issue 3, p330, 16p

Laser-Induced Forward Transfer of Pre-Patterned Solder Paste for High-Aspect-Ratio Deposits.

Authors: Liang, Chaofan Tian, Chongxin Zhang, Yanmei et al.

Source: Materials (1996-1944). Nov2025, Vol. 18 Issue 22, p5154. 21p.

Subjects: Solder pastes, Electronic packaging, Stencil printing, Laser deposition, Viscoelasticity

Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation.

Authors: Nair, Shyam Muralidharan Perera, Duwage Anushka Sandaruwan Farmer, Gavin et al.

Source: Journal of Microelectronic & Electronic Packaging. 2026, Vol. 23 Issue 1, p9-17. 9p.

Subjects: Wire bonding (Electronic packaging), Microelectronic packaging, Packaging industry, Corrosion prevention

SK Hynix Plans to Invest $13 Billion in New Chip Packaging Plant.

Authors: Lee, Yoolim Kim, Seyoon

Source: Bloomberg.com. 1/12/2026, pN.PAG-N.PAG. 1p.

A lightweight high precision real-time system for bonding ball–pad localization in industrial packaging inspection.

Authors: Wei, Haoran He, Zhenzhi Ye, Guo et al.

Source: Measurement Science & Technology. 2026, Vol. 37 Issue 27, p1-17. 17p.

Subjects: Wire bonding (Electronic packaging), Real-time computing, Artificial neural networks, Inspection & review, Electronic packaging

Investigation into Response Characteristics and Fault Diagnosis Methods for Intermittent Faults in High-Density Integrated Circuits Induced by Bonding Wires.

Authors: Yang, Wenxiang Zhang, Yong Cheng, Xianzhe et al.

Source: Applied Sciences (2076-3417); Jan2026, Vol. 16 Issue 2, p949, 29p

Chemical Mechanical Polishing of Plasma‐Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.

Authors: Kang, Sukkyung Jeon, Chansu Park, Juseong et al.

Source: Advanced Science. 1/14/2026, Vol. 13 Issue 3, p1-10. 10p.

Microstructures and Mechanical Properties of TiC-Reinforced Red Mud–Alumina Composite Ceramics.

Authors: Wang, Zhengliang Li, Anmin Shi, Yunchuan

Source: Crystals (2073-4352); Jan2026, Vol. 16 Issue 1, p15, 15p

The Electromagnetic Shielding Effectiveness of Polypropylene Nanocomposite Filled with Graphene.

Authors: Al-Tweissi, Mohammed Hussein, Omer

Source: Journal of Nano- & Electronic Physics; 2026, Vol. 18 Issue 1, p01006-1-01006-5, 5p

Research on Zero Value Effect of Positive and Negative Thermal Expansion Mixed Ceramic Fillers and Its Application in BT Resin‐Based Composites.

Authors: Zhou, Zikang Liang, Fei Zeng, Yuyao et al.

Source: Polymer Composites. 12/10/2025, Vol. 46 Issue 17, p16302-16310. 9p.

Effect of Current Density on Shear Performance and Fracture Behavior of Cu/Sn-58Bi/Cu Solder Joints.

Authors: Pan, Kailin Chen, Zimeng Liu, Menghao et al.

Source: Crystals (2073-4352); Nov2025, Vol. 15 Issue 11, p945, 18p

Source: Gentherm Inc. MarketLine Company Profile. 9/5/2025, p1-28. 28p.

Subject Terms: *Automobile industry, *Thermal management (Electronic packaging)

Geographic Terms: United States

Company/Entity: Gentherm Inc.