Search Results - "Electronics packaging"

Effects of the Encapsulating Resin on the Junction Temperature of the QFN16 and QFN32 Electronic Packages Subjected to Free Convection.

Authors: Baïri, Abderrahmane Haddad, Oriana Guinart, Jean-Pascal et al.

Source: Heat Transfer Engineering. 2018, Vol. 39 Issue 4, p353-358. 6p. 1 Diagram, 4 Graphs.

Subjects: Electronics packaging, Free convection, Plastic embedment of electronic equipment, Thermal conductivity, Heat transfer

Heat Flow Pattern and Thermal Resistance Modeling of Anisotropic Heat Spreaders.

Authors: Falakzaadeh, F. Mehryar, R.

Source: Journal of Electronic Materials. Jan2017, Vol. 46 Issue 1, p64-72. 9p.

Subjects: Heat equation, Electronics packaging, Isotropic properties, Thermal resistance, Anisotropy

SIGNAL INTEGRITY AND ELECTROMAGNETIC BROADBAND PACKAGING MODEL EXTRACTION OF FULL DIFFERENTIAL BANDPASS FILTER ON IPD WITH BGA PACKAGING.

Authors: Sung-Mao Wu Ren-Fang Hsu Po-Hui Yu

Source: Progress in Electromagnetics Research. 2013, Vol. 141, p201-217. 17p.

Subjects: Electronics packaging, Technical specifications, New product development, Substrates (Materials science), Electric lines, Internet protocols, Electric interference

Reliability of Ceramic Column Grid Array (CCGA717) Interconnect Packages Under Extreme Temperatures for Space Applications.

Authors: Ramesham, Rajeshuni¹ Rajeshuni.Ramesham@jpl.nasa.gov

Source: Journal of Microelectronic & Electronic Packaging. 2010 1st Quarter, Vol. 7 Issue 1, p16-24. 9p. 7 Black and White Photographs, 2 Diagrams, 1 Chart, 11 Graphs.

Subjects: Electronics packaging, Ceramic superconductors, Integrated circuit interconnections, Astronautical instruments, Microprocessors, Strength of materials, Solder & soldering, Performance technology, Optical quality control

Reliability behavior of lead-free solder joints in electronic components.

Authors: Zhang, Liang Han, Ji-guang He, Cheng-wen et al.

Source: Journal of Materials Science: Materials in Electronics; Jan2013, Vol. 24 Issue 1, p172-190, 19p

Error Reduction in Infrared Thermography by Multiframe Super-Resolution.

Authors: Chandramohan, Aditya Lyons, Sara K. Weibel, Justin A. et al.

Source: Journal of Electronic Packaging. Dec2018, Vol. 140 Issue 4, p1-8. 8p.

Subjects: Electronics packaging, High resolution imaging, Emissivity

3-D Wire Bondless Switching Cell Using Flip-Chip-Bonded Silicon Carbide Power Devices.

Authors: Seal, Sayan Glover, Michael D. Mantooth, H. Alan

Source: IEEE Transactions on Power Electronics. Oct2018, Vol. 33 Issue 10, p8553-8564. 12p.

Subjects: Chip scale packaging, Electronics packaging, Wide gap semiconductors, Electric properties, Silicon carbide, Three-dimensional display systems

Long-Term Storage of Electronic Components and Compositions.

Authors: Heimsch, Rich¹

Source: SMT: Surface Mount Technology. Jun2017, Vol. 32 Issue 6, p42-45. 3p. 1 Color Photograph.

Why is CD Packaging So Godawful?

Authors: Maroney, Tyler

Source: Fortune. 11/8/1999, Vol. 140 Issue 9, p54-54. 2/3p. 1 Color Photograph.

A Review on Laser Processing in Electronic and MEMS Packaging.

Authors: Rahim, Kaysar Mian, Ahsan

Source: Journal of Electronic Packaging. Sep2017, Vol. 139 Issue 3, p1-11. 11p.

Subjects: Electronics packaging, Microelectromechanical systems, Manufacturing processes, Fabrication (Manufacturing), Lasers

Evaluation of Thick-Film Materials for High-Temperature Packaging.

Authors: Zhou, Zhangming Cui, Jinzi Yu, Fang et al.

Source: IEEE Transactions on Components, Packaging & Manufacturing Technology. May2018, Vol. 8 Issue 5, p773-783. 11p.

Subjects: Thick-film circuits, Electronics packaging, Stray currents, Reliability of electronics, Packaging materials

Packaging Solution for a Millimeter-Wave System-on-Chip Radar.

Authors: Goettel, Benjamin Winkler, Wolfgang Bhutani, Akanksha et al.

Source: IEEE Transactions on Components, Packaging & Manufacturing Technology. Jan2018, Vol. 8 Issue 1, p73-81. 9p.

Subjects: Electronics packaging, Integrated circuits, Simulation methods & models, Printed circuit design, Radio transmitter-receivers

Present and future thermal interface materials for electronic devices.

Authors: Razeeb, Kafil M. Dalton, Eric Cross, Graham Lawerence William et al.

Source: International Materials Reviews. Jan2018, Vol. 63 Issue 1, p1-21. 21p.

Subjects: Thermal interface materials, Electronics packaging, Integrated circuits, Heat sinks (Electronics), Thermal resistance

Achieving cost and performance goals using 3D semiconductor packaging.

Authors: Solberg, Vern¹

Source: Solid State Technology; Aug/Sep2010, Vol. 53 Issue 8, p24-31, 3p

Using Taguchi method to obtain the optimal design of heat dissipation mechanism for electronic component packaging.

Authors: Huang, De-Shau Tu, Wen-Bin Zhang, Xiu-Ming et al.

Source: Microelectronics Reliability. Oct2016, Vol. 65, p131-141. 11p.

Subjects: Electronics packaging, Taguchi methods, Optimal designs (Statistics), Heat transfer, Energy dissipation

In Pursuit of the Perfect Cover Tape.

Authors: Adams, James T.

Source: SMT: Surface Mount Technology. Apr2013, Vol. 28 Issue 4, p30-34. 3p.

Thermal tablet for the blind.

Authors: Kos, Andrzej Boron, Krzysztof Brzozowski, Ireneusz

Source: Microelectronics International. 2016, Vol. 33 Issue 1, p1-8. 8p.

Subjects: Tablet computers, Electronics packaging, Blind people, Microelectronics, Chip-on-board assembly, Computer engineering

Hardness Characteristics of Au Cone-Shaped Bumps Targeted for 3-D Packaging Applications.

Authors: Ying Ying Lim Hiroshi Nakagawa Masaru Hashino et al.

Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2019, Vol. 9 Issue 3, p419-426, 8p

Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes.

Authors: Shang, Andrew W. Lo, Jeffery C. C. Lee, Ricky S. W.

Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2019, Vol. 9 Issue 3, p562-566, 5p

$48\times10$ -Gb/s Cost-Effective FPC-Based On-Board Optical Transmitter and Receiver.

Authors: Li, Teng Li, Chenhui Dorrestein, Sander et al.

Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; Aug2018, Vol. 8 Issue 8, p1353-1362, 10p