Search Results - "Han, Seonghui"

Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding.

Authors: Han, Seonghui Han, Sang-Eun Lee, Tae-Young et al.

Source: Materials (1996-1944). Jul2024, Vol. 17 Issue 14, p3619. 11p.

Thermally cycling-stable and highly heat-dissipative BGA packages manufactured by fluxless laser soldering: Experimental and numerical investigations.

Authors: Kim, Dongjin Han, Seonghui Baik, Junha et al.

Source: Microelectronics Reliability. Mar2026, Vol. 178, pN.PAG-N.PAG. 1p.

Subjects: Solder & soldering, Ball grid array technology, Metal compounds, Energy dissipation, Thermocycling, Thermal shock

Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).

Authors: Han, Sang-Eun Choi, Dong-Gyu Han, Seonghui et al.

Source: Materials (1996-1944). Apr2025, Vol. 18 Issue 8, p1834. 14p.