Search Results - "High temperature electronics"

High-temperature memristors enabled by interfacial engineering.

Authors: Zhao, Jian Jorgensen, Cameron S. Mahalingam, Krishnamurthy et al.

Source: Science. 5/14/2026, Vol. 392 Issue 6799, p771-779. 9p.

Development of a High-Frequency, High-Temperature Class-A Amplifier Based on a Silicon Carbide Static Induction Transistor.

Authors: Scardelletti, Maximilian C. Grgat, Jonathon R. Zorman, Christian A.

Source: Sensors (14248220). Jun2026, Vol. 26 Issue 12, p3646. 18p.

金星着陆器长寿命生存技术研究进展.

Alternate Title: Research Progress on Long-lived Survival Technology of Venus Lander.

Authors: 王虎军 褚英志 张 晓 et al.

Source: Chinese Journal of Space Science. 2025, Vol. 45 Issue 6, p1492-1505. 14p.

A Review of Novel Die Attach Materials for High-Temperature WBG Power Electronic Applications.

Authors: Wu, Na Li, Yuxiang

Source: Materials (1996-1944). Aug2025, Vol. 18 Issue 16, p3841. 27p.

Subjects: High temperatures, High temperature electronics, Joining processes, Nanoparticles, Thermal interface materials, Adhesives

Numerical simulation of heat transfer characteristics of high temperature devices based on nonlinear partial differential equations.

Authors: Zhang, Yan Shi, Ruchuan

Source: Journal of Combinatorial Mathematics & Combinatorial Computing. Dec2025, Vol. 127b, p3753-3769. 17p.

Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging.

Authors: Li, Mulan Huang, Shijun Ding, Zifeng et al.

Source: Journal of Electronic Materials; Aug2025, Vol. 54 Issue 8, p6054-6068, 15p

Exploring the thermal properties of gallium sulfide (GaS) for high-temperature applications.

Authors: Isik, M. Altuntas, G. Gasanly, N. M.

Source: Applied Physics A: Materials Science & Processing. Jun2025, Vol. 131 Issue 6, p1-7. 7p.

Subjects: Differential thermal analysis, High temperature electronics, Thermophysical properties, Differential scanning calorimetry, Thermal stability

High-temperature electrical performance and interface adhesion performance of SiC-based Pt thin-film RTDs.

Authors: Fang, Ziyan Fang, Xudong Wu, Chen et al.

Source: Microsystems & Nanoengineering; 7/6/2026, Vol. 12 Issue 1, p1-15, 15p

AlN Transistors for Ultrahightemperature Electronics.

Authors: Hiroki, Masanobu Hirama, Kazuyuki Taniyasu, Yoshitaka

Source: NTT Technical Review. Jun2026, Vol. 24 Issue 6, p21-26. 6p.

Electrically Active Defects in 3C, 4H, and 6H Silicon Carbide Polytypes: A Review.

Authors: Capan, Ivana¹

Source: Crystals (2073-4352); Mar2025, Vol. 15 Issue 3, p255, 20p

Synergistic ultra high dielectric permittivity of LiSnFeO4 solid solution for multifunctional high temperature electronics devices.

Authors: Padhy, Aniket Nayak, Praveen Priyaranjan Hota, S.S. et al.

Source: Ceramics International. Dec2025:Part B, Vol. 51 Issue 30, p64229-64242. 14p.

Subjects: Permittivity, High temperature electronics, Dielectric polarization, Dielectric strength, Impedance spectroscopy, Electric conductivity, Hybrid materials

Thermally robust LiPON synaptic transistors with tunable plasticity for reservoir computing.

Authors: Luo, Zhiyuan Jiang, Zhengdong Jiao, Peicheng et al.

Source: NPJ Flexible Electronics; 4/16/2026, Vol. 10 Issue 1, p1-9, 9p

Synthesis, Characterization and Dielectric Properties of Cordierite-Based Ceramic Materials Mg 2 Al 4 Si 5 O 18 for Hi-Tech Applications.

Authors: Riouchi, Nassima Riouchi, Oussama Zari, Rkia et al.

Source: Journal of Composites Science; Apr2026, Vol. 10 Issue 4, p205, 25p

Near‐Theoretical Oxidation Resistance in Copper Powder Enabled by Scalable Plasma‐Assisted Few‐Layer Graphene Encapsulation.

Authors: Liao, Tao Liu, Bin Zhou, Hui et al.

Source: Advanced Functional Materials; 4/2/2026, Vol. 36 Issue 27, p1-8, 8p

Unveiling state-specific total-exchange dynamics in high-temperature N2–N2/N2–O2 collisions via QCT and neural-network modeling.

Authors: Hu, Yong-Xin Guo, Chang-Min Ma, Jian-Yi

Source: Journal of Chemical Physics. 3/28/2026, Vol. 164 Issue 12, p1-16. 16p.

Experimental and computational study of the high-temperature 2DEG mobility in AlGaN/GaN heterostructures.

Authors: Hosseinigheidari, Matinehsadat Datta, Animesh Niroula, John et al.

Source: Applied Physics Letters; 2/16/2029, Vol. 128 Issue 7, p1-7, 7p

Cyanate Copolymerized Epoxy Molding Compound: A Study on the Improved Thermal Performances by Optimizing Fillers Parameters.

Authors: Zhang, Tiandong Xue, Tangman Zhang, Xinle et al.

Source: Journal of Applied Polymer Science; 2/5/2026, Vol. 143 Issue 5, p1-16, 16p

Transient liquid phase bonding method of SnIn for high-temperature packaging.

Authors: Wang, Jianhao Yao, Yuyuan Jin, Haibin et al.

Source: Journal of Materials Science: Materials in Electronics. Jul2024, Vol. 35 Issue 19, p1-10. 10p.

Subjects: Copper-tin alloys, High temperature electronics, Solder & soldering, Packaging materials, Semiconductor materials, Semiconductor technology

Unraveling electrical transport and dielectric relaxation in P2-Type NaMg0.25Mn0.75O2: A promising layered oxide for high-temperature electronics.

Authors: Karmakar, S. Sahoo, S. Mohanty, H.S. et al.

Source: Ceramics International. Sep2025:Part A, Vol. 51 Issue 21, p32958-32966. 9p.

Subjects: High temperature electronics, Potential energy, Hopping conduction, Sol-gel materials, Charge carriers

Regulation of Pore Structure and High-temperature Fracture Behavior of CAC-bonded Alumina-Spinel Castables Based on Hydration Design.

Authors: Wenjing LIU Ning LIAO Yawei LI

Source: China's Refractories. 2024, Vol. 33 Issue 3, p22-29. 8p.