Search Results - "Howes PD"

A review of applications of machine learning in quantum dots research.

Authors: Malashin, Ivan Martysyuk, Dmitry Nelyub, Vladimir et al.

Source: Discover Nano; 2/27/2026, Vol. 21 Issue 1, p1-36, 36p

Harnessing of in situ processing data to predict mechanical properties of laser powder bed fusion AlSi10Mg.

Authors: Luo, Qixiang Huang, Nancy Bartles, Dean L. et al.

Source: Journal of Intelligent Manufacturing; Feb2026, Vol. 37 Issue 2, p909-931, 23p

Droplet-based single-cell RNA sequencing: decoding cellular heterogeneity for breakthroughs in cancer, reproduction, and beyond.

Authors: Luo, Haoxuan Hussain, Ansar Abbas, Musavir et al.

Source: Journal of Translational Medicine. 10/14/2025, Vol. 23 Issue 1, p1-10. 10p.

Effects of Ultra-High Cooling Rates on the Tensile and Cyclic Stress–Strain Behavior of Nanoscale Solder Materials.

Authors: Fardin, Sadib Moresalein, Md. Jawarul Motalab, Mohammad et al.

Source: Journal of Electronic Materials; Aug2025, Vol. 54 Issue 8, p6828-6846, 19p

Microstructural development in an Al–Cr–Co–Mn–Zr I-phase alloy processed by laser powder bed fusion.

Authors: Li, M. X. Rommel, S. Hung, C. J. et al.

Source: Journal of Materials Science; Feb2025, Vol. 60 Issue 7, p3539-3557, 19p

pH-tuned reversible self-assembly of Janus particles for enhanced Raman imaging and sensing.

Authors: Iftesum, Maria Dey, Mohan Kumar Prasad, Alisha et al.

Source: Analytical & Bioanalytical Chemistry. Dec2025, Vol. 417 Issue 30, p6755-6767. 13p.

Effects of Minor Addition of Cu and Ni on the Microstructure, Thermal and Mechanical Properties, and Wettability of Sn-58Bi Solder Alloys.

Authors: Sungkhaphaitoon, Phairote Chantaramanee, Suchart

Source: Journal of Electronic Materials; May2025, Vol. 54 Issue 5, p4154-4165, 12p

Characterization of thermal fatigue properties of lead-free Sn–Cu–Al–Mg solder alloy produced by powder metallurgy method.

Authors: Serin, Nimet Selin Soy, Berke Keskin, Gorkem et al.

Source: Journal of Materials Science: Materials in Electronics; Jan2025, Vol. 36 Issue 2, p1-12, 12p

Effects of Ga addition on the microstructure and mechanical performance of Sn-58Bi based alloys and the solder joints.

Authors: Li, Fusheng Xu, Lei Chen, Mingze et al.

Source: Journal of Materials Science: Materials in Electronics; Dec2024, Vol. 35 Issue 34, p1-12, 12p

Low-temperature lead-free SnBiIn solder for electronic packaging.

Authors: Zhang, Shannan Long, Weimin Li, Peiyan et al.

Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 10, p1-9, 9p

Low-melting and thermal-conducting Sn-Bi-Ag solder enhanced with SnO2 nanoparticles for reliable mini-LED microsystems.

Authors: Kang, Jiwan Sharma, Ashutosh Jung, Jae Pil

Source: Journal of Materials Science: Materials in Electronics; Apr2025, Vol. 36 Issue 12, p1-14, 14p

Microstructure and performance of high-speed laser-welded joints in novel heat-resistant Al–12Ce–0.4Sc alloy.

Authors: Ning, Jie Feng, Chao Zhang, Linjie et al.

Source: Journal of Materials Science; Jun2024, Vol. 59 Issue 23, p10461-10484, 24p

Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification.

Authors: Tu, Wenbin Wang, Hanbing Wang, Shanlin et al.

Source: Journal of Electronic Materials; Jun2024, Vol. 53 Issue 6, p3049-3062, 14p

Dissolution Behavior of Cu-2.0 wt.% Be (Alloy 25) and Cu-0.1 wt.% Fe (C19210) Substrates in Molten Sn-9 wt.%Zn Solder.

Authors: Laksono, Andromeda Dwi Shen, Yu-An Chen, Ting et al.

Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2024, Vol. 76 Issue 6, p2754-2762, 9p

Properties of highly controlled laser-melted aluminium–nickel eutectic alloys and fundamental insights on the dynamics of nonequilibrium thermal processing.

Authors: Das, Rakesh Dubey, Pawan Kumar Manna, Indranil et al.

Source: Journal of Materials Science; Jan2025, Vol. 60 Issue 3, p1598-1617, 20p

Effects of aging time and temperature on shear properties of Sn–Zn and Sn–Ag–Cu solder joints.

Authors: Gong, Shiliang Chen, Gaoqiang Qu, Songtao et al.

Source: Journal of Materials Science: Materials in Electronics; Apr2024, Vol. 35 Issue 11, p1-15, 15p

Effect of cobalt nanoparticles on mechanical properties of Sn–58Bi solder joint.

Authors: Nasir Bashir, M. Saad, Hafiz Muhammad Rizwan, Muhammad et al.

Source: Journal of Materials Science: Materials in Electronics; Oct2022, Vol. 33 Issue 28, p22573-22579, 7p

Effects of tin particles addition on structural and mechanical properties of eutectic Sn–58Bi solder joint.

Authors: Bashir, M. Nasir Saad, Hafiz Muhammad Rizwan, Muhammad et al.

Source: Journal of Materials Science: Materials in Electronics; Oct2022, Vol. 33 Issue 28, p22499-22507, 9p

Thermal Transformation of Discarded CRT Printed Circuit Boards for Recovery of Sn Values.

Authors: Gahlot, Rohit Dhawan, Nikhil

Source: Metallurgical & Materials Transactions. Part B; Aug2024, Vol. 55 Issue 4, p2388-2406, 19p

Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration.

Authors: Bashir, M. Nasir Khan, Niaz Bahadur Bashir, Shahid et al.

Source: Journal of Materials Science: Materials in Electronics; Feb2023, Vol. 34 Issue 5, p1-8, 8p