Search Results - "Integrated circuits"

Source: Anpec Electronics Corporation MarketLine Company Profile. 9/15/2025, p1-13. 13p.

Subject Terms: *Integrated circuits industry, Power management of integrated circuits

Geographic Terms: Taiwan

Company/Entity: Anpec Electronics Corp.

Samsung's Soaring Profit Fails to Lift Shares After AI Rally.

Authors: Lee, Yoolim (AUTHOR)

Source: Bloomberg.com. 7/6/2026, pN.PAG-N.PAG. 1p.

Broadcom, Apple Expand Partnership to 2031 With Custom Chips.

Authors: Gurman, Mark (AUTHOR)

Source: Bloomberg.com. 7/6/2026, pN.PAG-N.PAG. 1p.

Samsung Scores Profit Beat Due to Runaway Demand for AI Memory.

Authors: Lee, Yoolim (AUTHOR)

Source: Bloomberg.com. 7/6/2026, pN.PAG-N.PAG. 1p.

'Memory supply crisis': Wall Street triggers huge selloff in fear of looming chip shortages.

Authors: Edwards, Jim (AUTHOR)

Source: Fortune.com. 6/27/2026, pN.PAG-N.PAG. 1p.

MediaTek's Rally Signals Shift From Laggard to AI Contender.

Authors: Yu, Jeanny Hsu, Winnie

Source: Bloomberg.com. 6/11/2026, pN.PAG-N.PAG. 1p.

Source: Intel Corporation MarketLine Company Profile. 5/14/2026, p1-145. 145p.

Subject Terms: *Integrated circuits industry, *Computer software industry

Geographic Terms: United States

Company/Entity: Intel Corp. 047897855 INTC

Source: Tower Semiconductor Ltd. MarketLine Company Profile. 5/7/2026, p1-30. 30p.

Subject Terms: *Integrated circuits industry

Geographic Terms: Israel

Company/Entity: Tower Semiconductor Ltd. TSEM

Fehler in der IC-Qualifizierung vermeiden.

Source: Elektronik Industrie. mai2026, Issue 5, p38-41. 4p.

A novel approach for performance improvements of TSV and TTSV of 3D IC through thermoelectric effect and mechanical reliability analysis.

Authors: Chaudhuri, Debika Rahaman, Hafizur Ghosh, Tamal

Source: Sādhanā: Academy Proceedings in Engineering Sciences. Jun2026, Vol. 51 Issue 2, p1-10. 10p.

Subjects: Through-silicon via, Three-dimensional integrated circuits, Reliability in engineering, Thermoelectric effects, Finite element method, Thermal stresses

Broadcom, Apple Extend Tie-Up to 2031 With New Custom Chips.

Authors: Gurman, Mark (AUTHOR)

Source: Bloomberg.com. 7/6/2026, pN.PAG-N.PAG. 1p.

Taiwan Chip Firm Unimicron Seeks Up to $1.4 Billion in Offering.

Authors: Sebastian, Dave Fioretti, Julia

Source: Bloomberg.com. 7/6/2026, pN.PAG-N.PAG. 1p.

Hong Kong Rises as Crucial Node in Asia's $2 Trillion AI Trade.

Authors: Gan, Nectar Mayger, James

Source: Bloomberg.com. 7/3/2026, pN.PAG-N.PAG. 1p.

Asian Stocks Slip on AI Woes, Oil Extends Drop: Markets Wrap.

Authors: Krishnamoorthy, Anand (AUTHOR)

Source: Bloomberg.com. 7/2/2026, pN.PAG-N.PAG. 1p.

Tech Stocks Retreat Deepens Ahead of US Payrolls: Markets Wrap.

Authors: van Vuuren, Andre Janse Muñoz, Macarena

Source: Bloomberg.com. 7/2/2026, pN.PAG-N.PAG. 1p.

Apple Seeks to Buy Chinese-Made Memory Chips With Lobbying Push.

Authors: Gurman, Mark Eastland, Maggie

Source: Bloomberg.com. 7/1/2026, pN.PAG-N.PAG. 1p.

S. Korea's Exports Stay Strong as AI Boom Fuels Chips Demand.

Authors: Lee, Heesu (AUTHOR)

Source: Bloomberg.com. 6/30/2026, pN.PAG-N.PAG. 1p.

US Stocks Rally as Dip Buyers Lift Tech, Mideast Fighting Eases.

Authors: Leon, Joel (AUTHOR)

Source: Bloomberg.com. 6/29/2026, pN.PAG-N.PAG. 1p.

Samsung, SK to Spend $880 Billion to Drive Korea's AI Lead.

Authors: Lee, Yoolim Choi, Soo-Hyang

Source: Bloomberg.com. 6/29/2026, pN.PAG-N.PAG. 1p.

Stocks Hit by Tech Selloff as Korean Shares Plunge: Markets Wrap.

Authors: van Vuuren, Andre Janse Amin, Ruhell

Source: Bloomberg.com. 6/23/2026, pN.PAG-N.PAG. 1p.