Search Results - "Larrey, V."

Mechanisms of sodium hydroxide (NaOH)-catalyzed sealing of SiO2/SiO2 direct bonding interfaces.

Authors: Noel, P. Rieutord, F. Larrey, V. et al.

Source: Journal of Applied Physics; 8/7/2025, Vol. 138 Issue 5, p1-10, 10p

Exploring Chemical Catalytic Mechanisms for Enhancing Bonding Energy in Direct Silicon Dioxide Wafer Bonding.

Authors: Calvez, Aziliz Larrey, Vincent Noël, Paul et al.

Source: Applied Sciences (2076-3417); Apr2025, Vol. 15 Issue 7, p3883, 17p

A Photovoltaic-Integrated Broadband Photodetector Based on Vertically-Stacked Lateral-Aligned Nanowire Arrays.

Authors: Jin, Ke Yan, Xin Li, Yao et al.

Source: Sensors (14248220). Dec2025, Vol. 25 Issue 23, p7308. 12p.

Amorphous Alumina ALD Coatings for the Protection of Limestone Cultural Heritage Objects.

Authors: Boyce, Gillian P. Sreenilayam, Suveena Balliana, Eleonora et al.

Source: Coatings (2079-6412); Aug2024, Vol. 14 Issue 8, p931, 19p

Low-Temperature Direct Bonding of SiC to Si via Plasma Activation.

Authors: Wang, Fengxuan Yang, Xiang Zhao, Yongqiang et al.

Source: Applied Sciences (2076-3417); Apr2022, Vol. 12 Issue 7, p3261-3261, 9p

Thin dielectric to dielectric hydrophilic wafer bonding for FD-SOI and C-FET manufacturing.

Authors: Noel, P. Larrey, V. Tardif, S. et al.

Source: Solid-State Electronics; Nov2025, Vol. 229, pN.PAG-N.PAG, 1p

Double cantilever beam bonding energy measurement using confocal IR microscopy.

Authors: Colonel, L. Calvez, A. Fournel, F. et al.

Source: Journal of Applied Physics; 12/7/2022, Vol. 132 Issue 21, p1-11, 11p

Deterministic Fabrication of Fluorescent Nanostructures Featuring Distinct Optical Transitions.

Authors: Rikers, Marijn Bashiri, Ayesheh Barreda, Ángela et al.

Source: Nanomaterials (2079-4991). Feb2025, Vol. 15 Issue 3, p219. 12p.

Subjects: Electron beam lithography, Opacity (Optics), Magnetic transitions, Fluorescent polymers, Magnetic dipoles

Organosilicone Compounds in Supercritical Carbon Dioxide.

Authors: Sizov, Victor E. Zefirov, Vadim V. Gallyamov, Marat O. et al.

Source: Polymers (20734360). Jun2022, Vol. 14 Issue 12, p2367-N.PAG. 18p.

CFET channel stack fabrication by wafer-to-wafer bonding and BESOI donor dismounting.

Authors: Tchoulfian, P. Barge, D. Hartmann, J.M. et al.

Source: Materials Science in Semiconductor Processing; Nov2026, Vol. 214, pN.PAG-N.PAG, 1p

Laser ablation and stealth dicing of full-thickness silicon wafer.

Authors: Son, Yeongil Shin, Joonghan

Source: International Journal of Advanced Manufacturing Technology. Mar2025, Vol. 137 Issue 3, p1599-1614. 16p.

Experimentally probing ionic solutions in single-digit nanoconfinement.

Authors: Rébiscoul D Baum M Wang K et al.

Source: Journal of colloid and interface science [J Colloid Interface Sci] 2022 May 15; Vol. 614, pp. 396-404. Date of Electronic Publication: 2022 Jan 25.

Publication Type: Journal Article

Journal Info: Publisher: Academic Press Country of Publication: United States NLM ID: 0043125 Publication Model: Print-Electronic Cited Medium: Internet ISSN: 1095-7103 (Electronic) Linking ISSN: 00219797 NLM ISO Abbreviation: J Colloid Interface Sci Subsets: MEDLINE

1.55-μm-Range Vertical-Cavity Surface-Emitting Lasers, Manufactured by Wafer Fusion of Heterostructures Grown by Solid-Source Molecular-Beam Epitaxy.

Authors: Blokhin, S. A. Nevedomsky, S. N. Bobrov, M. A. et al.

Source: Semiconductors. Oct2020, Vol. 54 Issue 10, p1276-1283. 8p.

Room-temperature bonding of Al2O3 thin films deposited using atomic layer deposition.

Authors: Takakura, Ryo Murakami, Seigo Watanabe, Kaname et al.

Source: Scientific Reports. 3/3/2023, Vol. 13 Issue 1, p1-7. 7p.

Effects of static load and residual stress on fused silica direct bonding interface properties.

Authors: Birckigt, Pascal Grabowski, Kevin Leibeling, Gilbert et al.

Source: Applied Physics A: Materials Science & Processing. Dec2021, Vol. 127 Issue 12, p1-12. 12p. 1 Color Photograph, 2 Black and White Photographs, 8 Diagrams, 2 Charts, 3 Graphs.

Cu-Based Thermocompression Bonding and Cu/Dielectric Hybrid Bonding for Three-Dimensional Integrated Circuits (3D ICs) Application.

Authors: Huang, Yuan-Chiu Lin, Yu-Xian Hsiung, Chien-Kang et al.

Source: Nanomaterials (2079-4991). Sep2023, Vol. 13 Issue 17, p2490. 19p.

Subjects: Three-dimensional integrated circuits, Hybrid securities, Copper, Sealing (Technology), Metal bonding, Interfacial bonding

InGaAs-OI Substrate Fabrication on a 300 mm Wafer.

Authors: Sollier, Sebastien Widiez, Julie Gaudin, Gweltaz et al.

Source: Journal of Low Power Electronics & Applications; Dec2016, Vol. 6 Issue 4, p19, 5p, 1 Color Photograph, 2 Black and White Photographs

Structure and Surface Morphology Effect on the Cytotoxicity of [Al2O3/ZnO]n/316L SS Nanolaminates Growth by Atomic Layer Deposition (ALD).

Authors: Osorio, D. Lopez, J. Tiznado, H. et al.

Source: Crystals (2073-4352); Jul2020, Vol. 10 Issue 7, p620, 1p

Anisotropic Radiation in Heterostructured "Emitter in a Cavity" Nanowire.

Authors: Kuznetsov, Alexey Roy, Prithu Kondratev, Valeriy M. et al.

Source: Nanomaterials (2079-4991). Jan2022, Vol. 12 Issue 2, p241-241. 1p.

Subjects: Semiconductor nanowires, Nanowires, Fabry-Perot resonators, Radiation, Refractive index, Numerical calculations, Photoluminescence

Subwavelength Silicon Nanoblocks for Directional Emission Manipulation.

Authors: Zhang, Tianyue Li, Xuewei Xu, Jian et al.

Source: Nanomaterials (2079-4991). Jun2020, Vol. 10 Issue 6, p1242. 1p.

Subjects: Plane wavefronts, Silicon, Magnetic resonance, Scattering (Physics), Radiation, Nanosatellites