Search Results - "Letize, Adam"

Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.

Authors: Pingping Ye Jianwen Han Braye, Stephan et al.

Source: Journal of Microelectronic & Electronic Packaging. 2024, Vol. 21 Issue 1, p20-24. 5p.

Advanced Electrochemical Plating Processes of Nano-Twinned Copper for Hybrid Bonding.

Authors: Jianwen Han Pingping Ye Braye, Stephan et al.

Source: Advancing Microelectronics. 2025, Vol. 52 Issue 5, p10-13. 4p.

Subjects: Wafer level packaging, Semiconductor wafer bonding, Crystal growth, Packaging equipment, Copper crystals, Electroplating

Metastable Fine Grain Cu for Hybrid Bonding Applications.

Authors: Ye, Pingping Han, Jianwen Braye, Stephan et al.

Source: Advancing Microelectronics. 2025, Vol. 52 Issue 4, p30-33. 4p.

Subjects: Grain refinement, Thermal stability, Interfacial bonding, Nanostructured materials, Annealing of metals, Rapid thermal processing

Metastable Fine Grain Cu for Hybrid Bonding Applications.

Authors: Pingping Ye Jianwen Han Braye, Stephan et al.

Source: Advancing Microelectronics. 2024, Vol. 51 Issue 5, p6-9. 4p.

Subjects: Hybrid securities, Copper, Temperature

Electrochemical Plating System Development of Nanotwinned Cu for Multiple WLP Features.

Authors: Jianwen Han Pingping Ye Braye, Stephan et al.

Source: Advancing Microelectronics. Sep/Oct2022, Vol. 49 Issue 5, p12-15. 4p.

Subjects: Copper, Systems development, Wafer level packaging, Hybrid securities, Stainless steel