Search Results - "Lin, Pin-Ling"

Grain refinement and interfacial IMCs suppression via Zn addition to enhance the mechanical properties of Cu/Sn-58Bi/Cu microbump.

Authors: Lin, Pin-Ling Wu, Zih-You Lee, Yin-Ku et al.

Source: Journal of Materials Science: Materials in Electronics; Sep2025, Vol. 36 Issue 27, p1-9, 9p