Search Results - "Microelectronic packaging"

S. Korea's Exports Stay Strong as AI Boom Fuels Chips Demand.

Authors: Lee, Heesu (AUTHOR)

Source: Bloomberg.com. 6/30/2026, pN.PAG-N.PAG. 1p.

Japan's Trade Balance Swings to Deficit as Tech Imports Surge.

Authors: Nohara, Yoshiaki (AUTHOR)

Source: Bloomberg.com. 6/16/2026, pN.PAG-N.PAG. 1p.

Preparation and Anodic Bonding Performance of (PEG) 10 LiClO 4 /NaAlOSiO Solid Electrolyte for Packaging.

Authors: Du, Chao Zhao, Yali

Source: International Journal of Molecular Sciences. May2026, Vol. 27 Issue 9, p3837. 11p.

Japan's Export Growth Quickens as China Demand Rebounds.

Authors: Nohara, Yoshiaki (AUTHOR)

Source: Bloomberg.com. 4/21/2026, pN.PAG-N.PAG. 1p.

Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.

Authors: Chhawcharia, Pradeep Sabir, Mohammad Sharma, Ishita et al.

Source: Advances in Consumer Research. Dec2025, Vol. 2 Issue 6, p961-966. 6p.

Enhancing Cu-Cu Stitch Bonding Reliability on Cu Leadframe Through Ultrathin Cu-Selective Passivation.

Authors: Nair, Shyam Muralidharan Perera, Duwage Anushka Sandaruwan Farmer, Gavin et al.

Source: Journal of Microelectronic & Electronic Packaging. 2026, Vol. 23 Issue 1, p9-17. 9p.

Subjects: Wire bonding (Electronic packaging), Microelectronic packaging, Packaging industry, Corrosion prevention

Recent Progress in Structural Integrity Evaluation of Microelectronic Packaging Using Scanning Acoustic Microscopy (SAM): A Review.

Authors: Meshki Zadeh, Pouria Brand, Sebastian Dehghan-Niri, Ehsan

Source: Sensors (14248220). Dec2025, Vol. 25 Issue 24, p7499. 36p.

Enhancement of Cu-Cu Bonding Interfaces Through High Creep Rate in Nanocrystalline Cu.

Authors: Huang, Jian-Yuan Tran, Dinh-Phuc Lee, Kang-Ping et al.

Source: Materials (1996-1944). Aug2025, Vol. 18 Issue 16, p3725. 14p.

Subjects: Crystal grain boundaries, Microelectronic packaging, Kirkendall effect, Heat capacity, Metallic bonds

Packaging and Interconnect Reliability Constraints in NV-Center Quantum Sensors: A Microelectronics Integration Perspective.

Authors: Siow, Kim Shyong Wang, Wei Jie Yap, Seong Ling et al.

Source: Journal of Electronic Materials. Jul2026, Vol. 55 Issue 7, p5760-5774. 15p.

Subjects: Microelectronic packaging, Packaging materials, Integrated circuit interconnections, Scalability, Reliability in engineering

Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review.

Authors: Gan, Chong Leong Chung, Min-Hua Huang, Chen-Yu

Source: Microelectronics International. 2026, Vol. 43 Issue 3, p199-210. 12p.

Subjects: Microelectronic packaging, Reliability in engineering, Temperature control, Optical interconnects, Server farms (Computer network management), Engineering design

电子封装用功能梯度铝基复合材料研究应用进展.

Alternate Title: Progress in the Research and Application of Functionally Graded Aluminum Matrix Composites for Electronic Packaging.

Authors: 方, 杰 刘, 彦强 杨, 志宇 et al.

Source: Nonferrous Metals. Aug2025, Vol. 15 Issue 8, p1295-1305. 11p.

UV-curable, Transparent, and Low Volume-shrinkage Silicones for Efficient Mini-LED Encapsulation.

Authors: Zhang, Zi-Hua Ye, Juan Wen, Wei-Shan et al.

Source: Chinese Journal of Polymer Science (Springer Science & Business Media B.V.). Feb2026, Vol. 44 Issue 2, p599-610. 12p.

Subjects: Microelectronic packaging, Photopolymerization, Thermal stability, Transparency (Optics), Disulfides

WIRE BONDING: 2026 WORKSHOP.

Authors: Sarangapani, Murali Seppaenen, Henri

Source: Advancing Microelectronics. 2026, Vol. 53 Issue 2, p36-41. 6p.

Subjects: Wire bonding (Electronic packaging), Microelectronic packaging, Silicon detectors, Integrated circuit interconnections, Ultrasonic welding, Automatic optical inspection

Microstructural Refinement and Interfacial Evolution of Ge addition Sn-Bi-Zn Medium-Entropy Solders.

Authors: Li, Su Yue, Zhiyang Huang, Jianeng et al.

Source: Journal of Electronic Materials; Jul2026, Vol. 55 Issue 7, p6337-6350, 14p

Electromigration Reliability and Failure Mechanisms in Novel 3D Cu Stagger-via Interconnects for Advanced High-Density Fan-Out Packaging.

Authors: Shao, Kuan-Ju Chiu, Meng-Chun Hu, Jui-Yi et al.

Source: JOM: The Journal of The Minerals, Metals & Materials Society (TMS); Jun2026, Vol. 78 Issue 6, p5188-5206, 19p

Crystal Plasticity Simulations of Subgrain Formation in Sn-based Solders During Thermal Cycling.

Authors: Chiang, Kai-chieh Koslowski, Marisol

Source: Journal of Electronic Materials; May2026, Vol. 55 Issue 5, p4580-4589, 10p

In-Depth DFT-Based Analysis of the Structural, Mechanical, Thermodynamic, and Electronic Characteristics of CuP 2 and Cu 3 P: Insights into Material Stability and Performance.

Authors: Yu, Ching-Feng Cheng, Hsien-Chie

Source: Metals (2075-4701); Apr2025, Vol. 15 Issue 4, p369, 28p

Seed-mediated growth for aspect-ratio-tunable copper nanoplates.

Authors: Zhou, Yu Liang, Ying Fang, Bin et al.

Source: CrystEngComm. 1/5/2026, Vol. 28 Issue 1, p197-206. 10p.

Subjects: Electric conductivity, Microelectronic packaging, Adhesives, Chemical synthesis, Nanocrystal synthesis, Nanostructured materials

Cost-Effective High-Performance Flip Chip MicroLeadFrame® (fcMLF®) Package Introduction.

Authors: Hoefer, Luke Kim, KyungSu

Source: Advancing Microelectronics. 2026, Vol. 53 Issue 1, p14-18. 5p.

Subjects: Flip chip technology, Microelectronic packaging, Automotive engineering, Thermal properties, Printed circuits, Packaging industry, Power supply quality

Sancode Technologies' arm gets Odisha government's nod to set up OSAT Unit.

Source: Ace Analyser: Company News. 2/3/2026, pN.PAG-N.PAG. 1p.