Search Results - "Microelectronics"

Thermal Prediction for Efficient Management of Temperatures in System-in-Package (SiP) Using Machine Learning (ML).

Authors: Oukaira, Aziz Baba, Mhamed Filali Ettahri, Ouafaa et al.

Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 11, p5468, 32p

Formation of Color Centers in Silicon Under Irradiation: Quantum Technologies and Defect Engineering Strategies.

Authors: Apostolakopoulos, A. A. Filippatos, P. P. Davazoglou, K. et al.

Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 11, p5436, 20p

Source: STMicroelectronics N.V. MarketLine Company Profile. 4/20/2026, p1-70. 70p.

Subject Terms: *Semiconductor industry, *Microelectronics industry

Geographic Terms: Switzerland

Company/Entity: STMicroelectronics NV

Source: Elite Semiconductor Microelectronics Technology Inc. Company Profile. 3/25/2026, p1-14. 14p.

Subject Terms: *Semiconductor industry, *Microelectronics industry, Hsinchu County (Taiwan)

Company/Entity: Elite Semiconductor Microelectronics Technology Inc.

Source: Excelpoint Technology Pte. Ltd. MarketLine Company Profile. 3/5/2026, p1-17. 17p.

Subject Terms: *Electronic industries, *Microelectronics

Geographic Terms: Singapore

Company/Entity: Excelpoint Technology Pte. Ltd.

HSI: 一种面向多芯粒的高带宽低延时协议转换机制.

Alternate Title: HSI: A high-bandwidth and low-latency protocol conversion mechanism for multiple chiplets.

Authors: 王 勇 杨乾明 付文文 et al.

Source: Computer Engineering & Science / Jisuanji Gongcheng yu Kexue. Apr2026, Vol. 48 Issue 4, p580-589. 10p.

Subjects: Networks on a chip, Multichip modules (Microelectronics), Parallel processing, Data transmission systems

Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.

Authors: Chhawcharia, Pradeep Sabir, Mohammad Sharma, Ishita et al.

Source: Advances in Consumer Research. Dec2025, Vol. 2 Issue 6, p961-966. 6p.

NANODEVICES WITH MAJORITY STRUCTURES.

Authors: Melnyk, Oleksandr¹, oleksandr.melnyk@npp.kai.edu.ua

Source: Electronics & Control Systems; 2026, Vol. 88 Issue 2, p131-135, 5p

On the Use of the Meshless Material Point Method for Microelectronic Devices.

Authors: de Jong, Sjoerd D. M. van Driel, Willem D. Zhang, Guoqi

Source: Mathematics (2227-7390). Mar2026, Vol. 14 Issue 5, p866. 24p.

Multimaterial 3D Printing of Soft and Stretchable Electronics.

Authors: Dadras‐Toussi, Omid Hariprasad, Bhoomija Abidian, Mohammad Reza

Source: Advanced Science. 2/9/2026, Vol. 13 Issue 8, p1-15. 15p.

Source: AOI Electronics Co., Ltd. MarketLine Company Profile. 1/6/2026, p1-13. 13p.

Subject Terms: *Microelectronics industry

Geographic Terms: Japan

Company/Entity: Aoi Electronics Co. Ltd.

Source: SUSS MicroTec AG MarketLine Company Profile. 1/1/2026, p1-21. 21p.

Subject Terms: *Microelectronics industry

Geographic Terms: Germany

Company/Entity: SUSS MicroTec SE

Source: Excelpoint Technology Pte. Ltd. MarketLine Company Profile. 12/15/2025, p1-17. 17p.

Subject Terms: *Electronic industries, *Microelectronics

Geographic Terms: Singapore

Company/Entity: Excelpoint Technology Pte. Ltd.

Solderability Tests Toward Miniaturized Microelectronics: Applicability and Limitations of Micro-Wetting Balance Testing of SnAgCu and SnBi Solders.

Authors: Trinh, Cham Thi Wiese, Steffen

Source: Applied Sciences (2076-3417); Jan2026, Vol. 16 Issue 2, p601, 22p

Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.

Authors: Huang, Cheng-Hung Su, Hao-Wei

Source: Mathematics (2227-7390). Jan2026, Vol. 14 Issue 2, p327. 27p.

Magnetoelastic oscillation of current-carrying plates in an alternating magnetic field.

Authors: Indiaminov, Ravshan Djuraev, Adiljon Khakberdiyev, Sulton et al.

Source: Vibroengineering Procedia. Dec2025, Vol. 60, p237-243. 7p.

Development of two semiconducting supramolecular metallogels of Cd(II)- and Hg(II)-ions from 5-aminoisophthalic acid gelator for high-performance Schottky diodes and advanced microelectronic applications.

Authors: Dhibar, Subhendu Mohan, Aiswarya Some, Sangita et al.

Source: Discover Molecules (3004-9350). Dec2025, Vol. 2 Issue 1, p1-16. 16p.

Source: Alpha Microelectronics Corporation MarketLine Company Profile. 9/12/2025, p1-12. 12p.

Subject Terms: *Microelectronics industry, *Semiconductor industry

Geographic Terms: Hsinchu City (Taiwan)

Stick‐and‐Use Flexible K‐Ion Microbatteries with Ultrahigh Power Density and Long Lifespan Via Electron‐Ion Synergistic Tailoring.

Authors: Liu, Ao Wu, Mengfei Sun, Tianci et al.

Source: Advanced Energy Materials. 5/20/2026, Vol. 16 Issue 19, p1-10. 10p.

Subject Terms: *Energy storage, *Microelectronics, *Microstructure, *Electropolymerization

Semiconductors & Microelectronics in Middle School Technology & Engineering.

Authors: Strimel, Greg J. Lucas, Deana Lee, Yubin et al.

Source: Journal of Technology Education. Fall2025, Vol. 37 Issue 1, p32-67. 36p.

Subjects: Semiconductors, Microelectronics, Middle schools, Student engagement, Lesson planning, Technology education, Applied sciences, Vocational education