Search Results - "Microelectronics research"

Ferroelectric memories.

Authors: Scott, J.F. de Araujo, C.A. Paz

Source: Science (pre-March 2025). 12/15/1989, Vol. 246 Issue 4936, p1400. 6p. 1 Color Photograph, 5 Diagrams, 4 Graphs.

Electronically Configurable Molecular-Based Logic Gates.

Authors: Collier, C.P. Wong, E.W. Belohradsky, M. et al.

Source: Science (pre-March 2025). 7/16/1999, Vol. 285 Issue 5426, p391-394. 4p. 4 Diagrams, 4 Graphs.

Algorithm development for minor damage identification in vehicle bodies using adaptive sensor data processing.

Authors: Gontscharov, Sergei Baumgärtel, Hauke Kneifel, Andre et al.

Source: Interdisciplinarity in Engineering. 2014, Vol. 15, p587-595. 9p.

Subjects: Algorithm research, Microelectronics research, Information storage & retrieval systems, Electronic data processing, Electronic control

Experimental investigation of single-phase microjet cooling of microelectronics.

Authors: Rusowicz, Artur Leszczyński, Maciej Grzebielec, Andrzej et al.

Source: Archives of Thermodynamics. Sep2015, Vol. 36 Issue 3, p139-147. 9p.

Subjects: Microelectronics research, Very light jets, Cooling, Heat transfer, Microprocessors

A new approach to numerical analysis of reliability indices in electronics.

Authors: Geniy, Kuznetsov Evgen, Kravchenko

Source: EPJ Web of Conferences. 2015, Vol. 82, p1-6. 6p.

Numerical simulation of barrier height effect on output parameters, for a a-Si:H/nc-Si:H based solar cell.

Authors: Belfar, A. Aït.-Kaci, H.

Source: EPJ Web of Conferences. 2013, Issue 44, p03005-p.2-03005-p.5. 5p.

Reliability of printed circuit boards containing lead-free solder in aggressive environments.

Authors: Moshrefi-Torbati, M. Swingler, J.

Source: Journal of Materials Science: Materials in Electronics. Apr2011, Vol. 22 Issue 4, p400-411. 12p.

Subjects: Integrated circuit reliability, Microelectronics research, Solder & soldering, Thermal stresses, Eutectics, Lead-free electronics manufacturing processes

Low loss, temperature stable dielectric ceramics in ZnNb2O6–Zn3Nb2O8 system for LTCC applications.

Authors: Anjana, Prabhakaran Sreekumari Jawahar, Isuhak Naseema Sebastian, Mailadil Thomas

Source: Journal of Materials Science: Materials in Electronics. Jul2009, Vol. 20 Issue 7, p587-596. 10p. 3 Diagrams, 3 Charts, 11 Graphs.

Subjects: Microelectronics research, Low temperature engineering, Dielectrics research, Zinc oxide, Dielectric resonators, Permittivity, Molecular integrated circuits

DECLERCK OF IMEC.

Authors: Collins, Luke

Source: Engineering Management. Apr/May2003, Vol. 13 Issue 2, p42. 4p. 1 Color Photograph, 1 Diagram, 1 Graph.

Subjects: Electronics laboratories, Microelectronics research

Geographic Terms: Belgium

A Serpent Bridge Electromagnetic Bandgap Structure for Suppressing Simultaneous Switching Noise.

Authors: Lin, D.-B. Hung, K.-C. Wu, C.-T. et al.

Source: Journal of Electromagnetic Waves & Applications. Feb2009, Vol. 23 Issue 2/3, p213-220. 8p. 3 Diagrams, 1 Chart, 2 Graphs.

Subjects: Band gaps, Microelectronics research, Electric inductance, Mixed signal circuits, Electric impedance

Tackling the paradox: can attaining global research excellence be compatible with local technology development?

Authors: Van Helleputte, Johan Reid, Alasdair

Source: R&D Management. Jan2004, Vol. 34 Issue 1, p33-44. 12p.

Subjects: Microelectronics research, International Medical Equipment Collaborative (Organization), Research, Research institutes, Industrial policy, Management

Sol-Gel-Derived Amorphous- MgNb2 O6 Thin Films for Transparent Microelectronics.

Authors: Ho, Yi ‐ Da Chen, Kung ‐ Rong Huang, Cheng ‐ Liang et al.

Source: Journal of the American Ceramic Society. Nov2013, Vol. 96 Issue 11, p3375-3378. 4p. 4 Graphs.

Subjects: Thin film research, Microelectronics research, Sol-gel processes, Amorphous substances, Ceramics

Solution Layer Deposition: A Technique for the Growth of Ultra-Pure Manganese Oxides on Silica at Room Temperature.

Authors: Cure, Jérémy Piettre, Kilian Coppel, Yannick et al.

Source: Angewandte Chemie International Edition. 2/24/2016, Vol. 55 Issue 9, p3027-3030. 4p.

Sizes effect of CeSn on the whiskers growth of SnAgCuCe solder joints in electronic packaging.

Authors: Zhang, Liang Sun, Lei Han, Ji-guang et al.

Source: Journal of Materials Science: Materials in Electronics; Aug2015, Vol. 26 Issue 8, p6194-6197, 4p

Fumed-Alumina-Derived Nanoporous Alumina as a New Low- k Dielectric Material for Microelectronics Packaging.

Authors: Takizawa, Yoshihiro Chung, D.

Source: Journal of Electronic Materials; Jul2015, Vol. 44 Issue 7, p2211-2220, 10p, 2 Diagrams, 3 Charts, 3 Graphs

Design and Evaluation of Potentiometric Principles for Bladder Volume Monitoring: A Preliminary Study.

Authors: Shih-Ching Chen Tsung-Hsun Hsieh Wen-Jia Fan et al.

Source: Sensors (14248220). Jun2015, Vol. 15 Issue 6, p12802-12815. 14p.

AC Impedance Analysis of the Al/ZnO/p-Si/Al Schottky Diode: C-V Plots and Extraction of Parameters.

Authors: Benhaliliba, M. Ocak, Y. S. Mokhtari, H. et al.

Source: Journal of Nano- & Electronic Physics; 2015, Vol. 7 Issue 2, p02001-1-02001-4, 4p

A Study of Pb-Rich Dendrites in a Near-Eutectic 63Sn-37Pb Solder Microstructure via Laboratory-Scale Micro X-ray Computed Tomography ( μXCT).

Authors: Mertens, J.C.E. Williams, J.J. Chawla, Nikhilesh

Source: Journal of Electronic Materials; Dec2014, Vol. 43 Issue 12, p4442-4456, 15p

Sol-Gel-Derived Amorphous- MgNb2 O6 Thin Films for Transparent Microelectronics.

Authors: Ho, Yi ‐ Da Chen, Kung ‐ Rong Huang, Cheng ‐ Liang et al.

Source: Journal of the American Ceramic Society; Nov2013, Vol. 96 Issue 11, p3375-3378, 4p, 4 Graphs

The Design and Implementation of an EMC Pre-compliance Board.

Authors: Silva, F. R. L. Ribeiro, L. R. Dias, L. P. et al.

Source: PIERS Proceedings; Aug2013, p1267-1270, 4p