Search Results - "Multichip modules (Microelectronics)"

Thermal Prediction for Efficient Management of Temperatures in System-in-Package (SiP) Using Machine Learning (ML).

Authors: Oukaira, Aziz Baba, Mhamed Filali Ettahri, Ouafaa et al.

Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 11, p5468, 32p

HSI: 一种面向多芯粒的高带宽低延时协议转换机制.

Alternate Title: HSI: A high-bandwidth and low-latency protocol conversion mechanism for multiple chiplets.

Authors: 王 勇 杨乾明 付文文 et al.

Source: Computer Engineering & Science / Jisuanji Gongcheng yu Kexue. Apr2026, Vol. 48 Issue 4, p580-589. 10p.

Subjects: Networks on a chip, Multichip modules (Microelectronics), Parallel processing, Data transmission systems

Towards Next-Generation Chiplet Systems: Advances in Heterogeneous Integration and Packaging Technologies.

Authors: Chhawcharia, Pradeep Sabir, Mohammad Sharma, Ishita et al.

Source: Advances in Consumer Research. Dec2025, Vol. 2 Issue 6, p961-966. 6p.

Numerical and Experimental Estimation of Heat Source Strengths in Multi-Chip Modules on Printed Circuit Boards.

Authors: Huang, Cheng-Hung Su, Hao-Wei

Source: Mathematics (2227-7390). Jan2026, Vol. 14 Issue 2, p327. 27p.

A study on factors influencing thermal-cycling-induced passivation damages in semiconductor devices assembled utilizing a multi-chip package technique.

Authors: Lee, Seong-Min Yon, Kyung-Yol

Source: Journal of Mechanical Science & Technology. Jun2026, Vol. 40 Issue 6, p4431-4438. 8p.

Subjects: Semiconductor devices, Multichip modules (Microelectronics), Thermocycling, Polyimide films, Stress concentration, Thermal strain, Adhesives

Performance Assessment and Improvement of Two‐Phase Immersion Cooling for Multi‐Chip Module.

Authors: Zhou, Liqun Li, Qian Lin, Shi et al.

Source: Asia-Pacific Journal of Chemical Engineering. Jul/Aug2025, Vol. 20 Issue 4, p1-15. 15p.

Subjects: Multichip modules (Microelectronics), Computational fluid dynamics, Heat transfer fluids, Thermal equilibrium, Fluid velocity measurements, Temperature control, Phase transitions

Design and Experimental Validation of Compact NFC Antenna and Embedded SiP RFID Module Based on LTCC and PCB Technologies.

Authors: Pietriková, Alena Vehec, Igor Lenger, Tomáš et al.

Source: Acta Electrotechnica & Informatica; Jun2026, Vol. 26 Issue 2, p55-63, 9p

Development and Research on Multichip Microsystems Based on Modular Three-Dimensional Integration of Chips.

Authors: Chugunov, E. Yu. Timoshenkov, S. P. Pogalov, A. I.

Source: Russian Microelectronics. Dec2025, Vol. 54 Issue 7, p781-786. 6p.

Subjects: Multichip modules (Microelectronics), Finite element method, Modular design, Mechanical behavior of materials, Durability, Thermal resistance

System-level verification in the chiplet era.

Authors: Bartley, Mike¹

Source: Electronics World. Feb2026, Vol. 131 Issue 2053, p12-14. 3p.

Subjects: Verification of computer systems, Multichip modules (Microelectronics), Integrated circuits

A Failure Diagnosis Method for Multichip IGBT Modules Using a Novel Chip Failure Sensitive Parameter.

Authors: Du, Mingxing Tang, Chudong Yang, Jianxiong et al.

Source: International Journal of Circuit Theory & Applications. Mar2026, p1. 12p. 18 Illustrations.

Design and Development of ALU using Multi Chiplet Methodology for High-Performance Computing.

Authors: Rai, Amrita Shah, Owais Ahmad Khan, Imran Ahmed et al.

Source: Buletin Ilmiah Sarjana Teknik Elektro (BISTE); Feb2026, Vol. 8 Issue 1, p116-128, 13p

高功率大面积 AI 芯片液冷技术进展. (Chinese)

Authors: 邹启凡 刘 洪 罗海亮 et al.

Source: Journal of Refrigeration; Feb2026, Vol. 47 Issue 1, p20-36, 17p

Source: Fidelix Co., Ltd. MarketLine Company Profile. 10/30/2025, p1-13. 13p.

Subject Terms: *Mobile communication systems, Multichip modules (Microelectronics)

Geographic Terms: Songnam-si (Korea)

INSPECTION AND METROLOGY CHALLENGES IN HYBRID BONDING.

Authors: Kottur, Himanandhan Reddy Arjunamahanthi, Pavanbabu Biswas, Liton Kumar et al.

Source: Electronic Device Failure Analysis. May2026, Vol. 28 Issue 2, p12-24. 11p.

ISTFA 2025 SYSTEM IN PACKAGE (SIP) USER GROUP.

Authors: Tanukonda, Chandu O’Sullivan, Jer Qiu, Wen

Source: Electronic Device Failure Analysis. Feb2026, Vol. 28 Issue 1, p34-34. 2/3p.

Subjects: Failure analysis, Multichip modules (Microelectronics), Conferences & conventions, Problem solving, Packaging design

VCSEL Light Coupling to a Waveguide to Interconnect XPUs and HBMs on Interposer Chips.

Authors: Park, Sahnggi Kim, Kyungeun Rhee, Hyun-Woo et al.

Source: Photonics; Sep2025, Vol. 12 Issue 9, p873, 15p

Verification of Design and Process for Optimal Large-Area Substrate Eutectic Bonding in SiP Packaging.

Authors: Gao, Mingqi Lei, Dongyang Zhang, Yagang et al.

Source: Solids (2673-6497). Apr2026, Vol. 7 Issue 2, p18. 19p.

Source: Fidelix Co., Ltd. MarketLine Company Profile. 11/14/2024, p1-12. 12p.

Subject Terms: *Mobile communication systems, Multichip modules (Microelectronics)

Geographic Terms: Songnam-si (Korea)

Numerical Study of the Impact of Inter-Die Thermal Conductance on the Thermal Performance of 3D ICs Cooled by a Single-Layer Microchannel Heat Exchanger.

Authors: Zając, Piotr Zabierowski, Wojciech

Source: Energies (19961073). Dec2025, Vol. 18 Issue 23, p6150. 18p.

Chiplet-Technologie auf dem Vormarsch.

Source: Elektronik Industrie. 11/12/2025, Issue 11, p22-25. 4p.