Search Results - "Reliability of electronics"

Mitigating Multiphysics Interference in Semiconductor Aging via Physics-Embedded Incremental Evolution.

Authors: Yang, Cheng Liu, Zepeng Jiang, Chao et al.

Source: Energies (19961073). Jun2026, Vol. 19 Issue 12, p2750. 27p.

Subject Terms: *Reliability of electronics, *Prognostic models, *Machine learning, *Statistical models

Company/Entity: United States. National Aeronautics & Space Administration

Power-Law Degradation and Lifetime Interpretation in Microelectronics Reliability.

Authors: Bernstein, Joseph B.¹

Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 11, p5387, 21p

Temperature-Adaptive Branch Rotation Within an Efficiency-Oriented Control Framework for Interleaved Bidirectional DC–DC Converters Applied to Battery Energy Storage Systems.

Authors: Brandis, Andrej Mišljenović, Nemanja Hajdarpašić, Amar et al.

Source: Applied Sciences (2076-3417); Mar2026, Vol. 16 Issue 5, p2444, 42p

Fiber-Diode Hybrid Laser Welding of IGBT Copper Terminals.

Authors: Yang, Miaosen Lv, Qiqi Liu, Shengxiang et al.

Source: Metals (2075-4701); Feb2026, Vol. 16 Issue 2, p139, 20p

Enhancing information security and fault coverage in BIST with non-linear register updation.

Authors: Chinnappa Gounder, Kalamani D, Mythrayee A, Kodieswari et al.

Source: Information Security Journal: A Global Perspective. 2026, Vol. 35 Issue 1, p237-250. 14p.

EFFECT OF Cu-Cu HYBRID BONDING HEIGHT IN THE 3D STACKED DIE CONFIGURATION: THERMAL-STRUCTURAL ANALYSIS.

Authors: ABDUL AZIZ, MOHD SHARIZAL KHOR, C. Y. GOH, Z. L. et al.

Source: Archives of Metallurgy & Materials. 2025, Vol. 70 Issue 4, p1785-1790. 6p.

Subjects: Thermal strain, Reliability of electronics, Simulation methods & models, Thermal stresses, Ansys Inc., Copper wire, Yield stress, Stress concentration

Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.

Authors: Ma, Shuai Sun, Yi Nan, Yifei et al.

Source: Journal of Materials Science: Materials in Electronics. May2026, Vol. 37 Issue 13, p1-28. 28p.

Subjects: Reliability of electronics, Creep (Materials), Mechanical shock, Material fatigue, Ball grid array technology, Bayes' estimation, Finite element method

Maximizing Power Performance and Reliability in Demanding Environments.

Source: Microwave Journal. May2026, Vol. 69 Issue 5, p168-182. 8p.

Subjects: Reliability of electronics, Power resources management

THE MOST & LEAST RELIABLE.

Source: Consumer Reports. May/Jun2026, Vol. 91 Issue 3, p30-47. 18p. 23 Color Photographs, 1 Chart.

Maximizing Power Performance and Reliability in Demanding Environments.

Source: Microwave Journal. 2026 Special Issue, Vol. 69, p42-46. 3p.

Subjects: Reliability of electronics, Power resources management, Reliability in engineering, Electric power system reliability, Military research, Aerospace technology

Mechanical response and ductile-to-brittle fracture transition of Sn-0.3Ag-0.7Cu/Cu solder joints at cryogenic temperatures.

Authors: Jiang, Wen Wu, Wenwang Zhu, Yaxin et al.

Source: Journal of Materials Science; Jul2026, Vol. 61 Issue 27, p19834-19852, 19p

Aging and Electrical Stability of DNTT Honey‐Gated OFETs.

Authors: Vieira, Douglas H. de Paula, Ana C. Dias, José D. F. et al.

Source: Advanced Electronic Materials; 7/6/2026, Vol. 12 Issue 13, p1-11, 11p

Research on Nanoindentation of Single-Crystal Silicon Corners Based on Molecular Dynamics.

Authors: Long, Chao Xia, Jinyi Li, Ruihan et al.

Source: Journal of Materials Engineering & Performance; Jun2026, Vol. 35 Issue 22, p22611-22627, 17p

Effects of thermal cycling and room-temperature ageing on bismuth precipitates in Sn-Ag-Cu-Bi solder joints.

Authors: Hsieh, C. L. Coyle, R. J. Xian, J. W. et al.

Source: Journal of Materials Science; Jun2026, Vol. 61 Issue 23, p16674-16704, 31p

An advanced transient protection circuit for enhancing the overvoltage tolerance of MMC submodules.

Authors: You, Chao Ma, Jiancheng Chen, Xin

Source: Journal of Engineering & Applied Science; 6/11/2026, Vol. 73 Issue 1, p1-10, 10p

Nanomaterial-Enabled Smart Textiles: A Decade of Innovation, Challenges, and Future Frontiers Beyond Wearables.

Authors: Hossain, Md Raihan Ahmed, Md Raju Tonmoy, Amit Hasan et al.

Source: Journal of Electronic Materials; Jun2026, Vol. 55 Issue 6, p4899-4925, 27p

High-efficiency power electronic devices based on wide-bandgap semiconductor materials.

Authors: Zhang, Jinqiang Gao, Qing Wang, Weidong et al.

Source: Journal of Power Electronics; Jun2026, Vol. 26 Issue 6, p1386-1395, 10p

An Investigation of the Indentation Elastic Modulus for Metal Films on Flexible Substrates Considering the Substrate Effect.

Authors: Lee, Jong-Hyup Ham, Ju-Been Kim, Young-Cheon

Source: Materials (1996-1944). Jan2025, Vol. 18 Issue 1, p154. 13p.

Subjects: Substrates (Materials science), Reliability of electronics, Metallic films, Finite element method, Stress concentration

Process Optimization of Additively Manufactured Conformal Temperature and Humidity Sensor for High-Temperature Applications.

Authors: Lamport, Emily Avuthu, Sai G. R. Si Chen et al.

Source: Journal of Microelectronic & Electronic Packaging. 2025, Vol. 22 Issue 1, p13-20. 8p.

Subjects: Reliability of electronics, Waste minimization, Temperature sensors, Printed electronics, Printed circuits

Analytical Modeling and Validation of Thermal Fatigue Failure in Die Attach Structures for Power Electronics Modules.

Authors: Luan, Xinghe Ding, Liguo Jiang, Danlei et al.

Source: Journal of Electronic Materials. Dec2025, Vol. 54 Issue 12, p11114-11132. 19p.

Subjects: Power electronics, Reliability of electronics, Simulation methods & models, Thermal fatigue, Failure time data analysis, Stress concentration, Structural components, Materials analysis