Search Results - "Reliability of electronics"

Mitigating Multiphysics Interference in Semiconductor Aging via Physics-Embedded Incremental Evolution.

Authors: Yang, Cheng Liu, Zepeng Jiang, Chao et al.

Source: Energies (19961073). Jun2026, Vol. 19 Issue 12, p2750. 27p.

Subject Terms: *Reliability of electronics, *Prognostic models, *Machine learning, *Statistical models

Company/Entity: United States. National Aeronautics & Space Administration

Neutron Shielding by Concrete Slabs and Its Impact on the Soft-Error Rate of Electronics in Nuclear Fusion.

Authors: Munteanu, Daniela Autran, Jean-Luc Moindjie, Soilihi et al.

Source: Applied Sciences (2076-3417); Jul2026, Vol. 16 Issue 14, p7139, 24p

Power-Law Degradation and Lifetime Interpretation in Microelectronics Reliability.

Authors: Bernstein, Joseph B.¹

Source: Applied Sciences (2076-3417); Jun2026, Vol. 16 Issue 11, p5387, 21p

Temperature-Adaptive Branch Rotation Within an Efficiency-Oriented Control Framework for Interleaved Bidirectional DC–DC Converters Applied to Battery Energy Storage Systems.

Authors: Brandis, Andrej Mišljenović, Nemanja Hajdarpašić, Amar et al.

Source: Applied Sciences (2076-3417); Mar2026, Vol. 16 Issue 5, p2444, 42p

Review: tin whisker growth—associated risks, and propensity assessment standards.

Authors: Zhang, Peigen Song, Haoze Xia, Xinxin et al.

Source: Journal of Materials Science. Sep2026, Vol. 61 Issue 35, p25940-25959. 20p.

Subjects: Metallic whiskers, Reliability of electronics, Units of measurement, Tin alloys, Hazards

Enhancing information security and fault coverage in BIST with non-linear register updation.

Authors: Chinnappa Gounder, Kalamani D, Mythrayee A, Kodieswari et al.

Source: Information Security Journal: A Global Perspective. 2026, Vol. 35 Issue 1, p237-250. 14p.

Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability.

Authors: NGUYEN, THUY ZHANG, HONGWEN LASKY, RONALD C. et al.

Source: SMT007 Magazine. Oct2026, Vol. 41 Issue 10, p32-41. 6p.

Fiber-Diode Hybrid Laser Welding of IGBT Copper Terminals.

Authors: Yang, Miaosen Lv, Qiqi Liu, Shengxiang et al.

Source: Metals (2075-4701); Feb2026, Vol. 16 Issue 2, p139, 20p

Analytical Modeling and Validation of Thermal Fatigue Failure in Die Attach Structures for Power Electronics Modules.

Authors: Luan, Xinghe Ding, Liguo Jiang, Danlei et al.

Source: Journal of Electronic Materials; Dec2025, Vol. 54 Issue 12, p11114-11132, 19p

EFFECT OF Cu-Cu HYBRID BONDING HEIGHT IN THE 3D STACKED DIE CONFIGURATION: THERMAL-STRUCTURAL ANALYSIS.

Authors: ABDUL AZIZ, MOHD SHARIZAL KHOR, C. Y. GOH, Z. L. et al.

Source: Archives of Metallurgy & Materials. 2025, Vol. 70 Issue 4, p1785-1790. 6p.

Subjects: Thermal strain, Reliability of electronics, Simulation methods & models, Thermal stresses, Ansys Inc., Copper wire, Yield stress, Stress concentration

Syrma SGS, Elemaster Group launch new electronics manufacturing facility in Bengaluru.

Source: Ace Analyser: Company News. 9/2/2026, pN.PAG-N.PAG. 1p.

Influence of structural design and electrode configuration on the electrical performance and reliability of polytetrafluoroethylene-based water drop triboelectric nanogenerators.

Authors: Jamal Rashid, Firdaus Ehsan, Abang Annuar Mohammad Haniff, Muhammad Aniq Shazni

Source: Energy & Environment. Nov2026, Vol. 37 Issue 7, p4634-4655. 22p.

Subject Terms: *Clean energy, Nanogenerators, Triboelectricity, Reliability of electronics, Electrode performance, Energy harvesting, Fluoropolymers

Interfacial Charge Modulation in Laminated Photovoltaic Backsheet‐Encapsulant Nanocomposites for Enhanced Dielectric Performance.

Authors: Feng, Kai Zhang, Jia‐Wei Mao, Qin‐Ling et al.

Source: Journal of Applied Polymer Science; 10/10/2026, Vol. 143 Issue 38, p1-13, 13p

Van der Waals Ferroelectrics Toward Non‐Volatile Nanoelectronics.

Authors: Wang, Lin Long, Yinfeng Chen, Han et al.

Source: Advanced Functional Materials; 10/5/2026, Vol. 36 Issue 80, p1-17, 17p

A comparative assessment of electrical reliability in screen-printed nonwoven substrates: Evolon versus Tyvek.

Authors: Maarouf, Abdelwahad Boudarbala, Hasnaa Cherouaki, Rachid et al.

Source: Journal of Materials Science: Composites; 10/1/2026, Vol. 7 Issue 1, p1-8, 8p

Analytical Modeling and Advanced Experimental Analysis of Natural Frequencies in Printed Circuit Boards.

Authors: Bumbea, Cosmin Bujoreanu, Carmen

Source: Bulletin of the Polytechnic Institute of Iași, Machine Construction Section; Sep2026, Vol. 72 Issue 3, p67-80, 14p

Stress Dissipation in Stretchable Organic Field‐Effect Transistors: Evaluation Metrics and Pathways.

Authors: Cao, Long Cao, Jin Feng, Yuguang et al.

Source: Advanced Materials Technologies; Sep2026, Vol. 11 Issue 17, p1-32, 32p

基于现有标准的汽车电子产品生产全流程质量及 可靠性验证. (Chinese)

Authors: 周舟 谢家佩 黄梓彬 et al.

Source: Automobile Technology & Material; 2026, Issue 9, p67-72, 6p

Maximizing Power Performance and Reliability in Demanding Environments.

Source: Microwave Journal. May2026, Vol. 69 Issue 5, p168-182. 8p.

Subjects: Reliability of electronics, Power resources management

Creep-shock fatigue reliability assessment of electronic component structures based on Bayesian estimation.

Authors: Ma, Shuai Sun, Yi Nan, Yifei et al.

Source: Journal of Materials Science: Materials in Electronics. May2026, Vol. 37 Issue 13, p1-28. 28p.

Subjects: Reliability of electronics, Creep (Materials), Mechanical shock, Material fatigue, Ball grid array technology, Bayes' estimation, Finite element method