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    Source: IEEE Transactions on Electron Devices; Mar2017, Vol. 64 Issue 3, p654-658, 5p

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    Source: VLSI Design; Nov2002, Vol. 15 Issue 3, p555-556, 2p

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    Authors: 高明子 杜涛明 张凯 et al.

    Source: CT Theory & Applications; Jan2026, Vol. 35 Issue 1, p171-180, 10p

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    Authors: Aiello, Orazio1

    Source: Journal of Low Power Electronics & Applications; Dec2025, Vol. 15 Issue 4, p59, 3p

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    Authors: Markov, Igor L.1, igor.markov@gmail.com

    Source: Communications of the ACM; Nov2024, Vol. 67 Issue 11, p60-71, 12p

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    Authors: Tan, Cher-Ming1, cmtan@cgu.edu.tw

    Source: Applied Sciences (2076-3417); Apr2022, Vol. 12 Issue 8, p4086, 6p

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    Source: Journal of Information Technology & Applications; Dec2019, Vol. 9 Issue 2, p52-52, 1p

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    Source: Journal of Information Technology & Applications; Jun2025, Vol. 15 Issue 1, p4-4, 2/3p

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    Authors: Vye, David

    Source: Microwave Journal; August 2008, Vol. 51 Issue 8, p106-119, 5p

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    Authors: Zeng, Jie Kong, Dan Liu, Bei et al.

    Source: EURASIP Journal on Wireless Communications & Networking; 1/10/2017, Vol. 2017 Issue 1, p1-9, 9p

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    Authors: Zwass, Vladimir

    Source: Journal of Management Information Systems; Summer92, Vol. 9 Issue 1, p3-6, 4p

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    Authors: ŞAHİN, Mustafa1, mustafasahin@aku.edu.tr

    Source: Afyon Kocatepe University Journal of Science & Engineering / Afyon Kocatepe Üniversitesi Fen Ve Mühendislik Bilimleri Dergisi; 2019, Vol. 19 Issue 2, p348-360, 13p

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