Advanced Cu chemical displacement technique for SiO-based electrochemical metallization ReRAM application.
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| Title: | Advanced Cu chemical displacement technique for SiO-based electrochemical metallization ReRAM application. |
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| Authors: | Chin, Fun-Tat1, p9751556@fcu.edu.tw, Lin, Yu-Hsien2, yhlin@nuu.edu.tw, You, Hsin-Chiang3, hcyou@ncut.edu.tw, Yang, Wen-Luh4, wlyang@fcu.edu.tw, Lin, Li-Min1, nash67.lin@msa.hinet.net, Hsiao, Yu-Ping1, heavenxaw11@yahoo.com.tw, Ko, Chum-Min4, abc951258@gmail.com, Chao, Tien-Sheng5, tschao@mail.nctu.edu.tw |
| Source: | Nanoscale Research Letters; Dec2014, Vol. 9 Issue 1, p1-6, 6p |
| Database: | Applied Science & Technology Source |
| FullText | Links: – Type: pdflink Text: Availability: 0 |
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| Header | DbId: aci DbLabel: Applied Science & Technology Source An: 100300642 AccessLevel: 2 PubType: Academic Journal PubTypeId: academicJournal PreciseRelevancyScore: 0 |
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| Items | – Name: Title Label: Title Group: Ti Data: Advanced Cu chemical displacement technique for SiO-based electrochemical metallization ReRAM application. – Name: Author Label: Authors Group: Au Data: <searchLink fieldCode="AU" term="%22Chin%2C+Fun-Tat%22">Chin, Fun-Tat</searchLink><relatesTo>1</relatesTo>, <i>p9751556@fcu.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Lin%2C+Yu-Hsien%22">Lin, Yu-Hsien</searchLink><relatesTo>2</relatesTo>, <i>yhlin@nuu.edu.tw</i><br /><searchLink fieldCode="AU" term="%22You%2C+Hsin-Chiang%22">You, Hsin-Chiang</searchLink><relatesTo>3</relatesTo>, <i>hcyou@ncut.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Yang%2C+Wen-Luh%22">Yang, Wen-Luh</searchLink><relatesTo>4</relatesTo>, <i>wlyang@fcu.edu.tw</i><br /><searchLink fieldCode="AU" term="%22Lin%2C+Li-Min%22">Lin, Li-Min</searchLink><relatesTo>1</relatesTo>, <i>nash67.lin@msa.hinet.net</i><br /><searchLink fieldCode="AU" term="%22Hsiao%2C+Yu-Ping%22">Hsiao, Yu-Ping</searchLink><relatesTo>1</relatesTo>, <i>heavenxaw11@yahoo.com.tw</i><br /><searchLink fieldCode="AU" term="%22Ko%2C+Chum-Min%22">Ko, Chum-Min</searchLink><relatesTo>4</relatesTo>, <i>abc951258@gmail.com</i><br /><searchLink fieldCode="AU" term="%22Chao%2C+Tien-Sheng%22">Chao, Tien-Sheng</searchLink><relatesTo>5</relatesTo>, <i>tschao@mail.nctu.edu.tw</i> – Name: TitleSource Label: Source Group: Src Data: <searchLink fieldCode="JN" term="%22Nanoscale+Research+Letters%22">Nanoscale Research Letters</searchLink>; Dec2014, Vol. 9 Issue 1, p1-6, 6p |
| PLink | https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=100300642 |
| RecordInfo | BibRecord: BibEntity: Identifiers: – Type: doi Value: 10.1186/1556-276X-9-592 Languages: – Code: eng Text: English PhysicalDescription: Pagination: PageCount: 6 StartPage: 1 Titles: – TitleFull: Advanced Cu chemical displacement technique for SiO-based electrochemical metallization ReRAM application. Type: main BibRelationships: HasContributorRelationships: – PersonEntity: Name: NameFull: Chin, Fun-Tat – PersonEntity: Name: NameFull: Lin, Yu-Hsien – PersonEntity: Name: NameFull: You, Hsin-Chiang – PersonEntity: Name: NameFull: Yang, Wen-Luh – PersonEntity: Name: NameFull: Lin, Li-Min – PersonEntity: Name: NameFull: Hsiao, Yu-Ping – PersonEntity: Name: NameFull: Ko, Chum-Min – PersonEntity: Name: NameFull: Chao, Tien-Sheng IsPartOfRelationships: – BibEntity: Dates: – D: 01 M: 12 Text: Dec2014 Type: published Y: 2014 Identifiers: – Type: issn-print Value: 19317573 Numbering: – Type: volume Value: 9 – Type: issue Value: 1 Titles: – TitleFull: Nanoscale Research Letters Type: main |
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