Three-Layer Zn/Al/Zn Clad Solder for Die Attachment.

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Bibliographic Details
Title: Three-Layer Zn/Al/Zn Clad Solder for Die Attachment.
Authors: Yamaguchi, T., takuto.yamaguchi.xu@hitachi.com, Ikeda, O.1, Oda, Y.2, ODA.YU@neomax.co.jp, Hata, S.3, Kuroki, K.3, Kuroda, H.3, Hirose, A.4
Source: Journal of Electronic Materials; Feb2015, Vol. 44 Issue 2, p751-760, 10p, 2 Color Photographs, 4 Black and White Photographs, 5 Diagrams, 3 Charts, 3 Graphs
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 100318866
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Three-Layer Zn/Al/Zn Clad Solder for Die Attachment.
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  Data: <searchLink fieldCode="AU" term="%22Yamaguchi%2C+T%2E%22">Yamaguchi, T.</searchLink>, <i>takuto.yamaguchi.xu@hitachi.com</i><br /><searchLink fieldCode="AU" term="%22Ikeda%2C+O%2E%22">Ikeda, O.</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Oda%2C+Y%2E%22">Oda, Y.</searchLink><relatesTo>2</relatesTo>, <i>ODA.YU@neomax.co.jp</i><br /><searchLink fieldCode="AU" term="%22Hata%2C+S%2E%22">Hata, S.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Kuroki%2C+K%2E%22">Kuroki, K.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Kuroda%2C+H%2E%22">Kuroda, H.</searchLink><relatesTo>3</relatesTo><br /><searchLink fieldCode="AU" term="%22Hirose%2C+A%2E%22">Hirose, A.</searchLink><relatesTo>4</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Electronic+Materials%22">Journal of Electronic Materials</searchLink>; Feb2015, Vol. 44 Issue 2, p751-760, 10p, 2 Color Photographs, 4 Black and White Photographs, 5 Diagrams, 3 Charts, 3 Graphs
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=100318866
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s11664-014-3538-y
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      – Code: eng
        Text: English
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        PageCount: 10
        StartPage: 751
    Titles:
      – TitleFull: Three-Layer Zn/Al/Zn Clad Solder for Die Attachment.
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            NameFull: Yamaguchi, T.
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            NameFull: Ikeda, O.
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            NameFull: Oda, Y.
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            NameFull: Hata, S.
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            NameFull: Kuroki, K.
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            NameFull: Kuroda, H.
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            NameFull: Hirose, A.
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            – D: 01
              M: 02
              Text: Feb2015
              Type: published
              Y: 2015
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              Value: 44
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            – TitleFull: Journal of Electronic Materials
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