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Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism.

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Title: Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism.
Authors: Alberti, R.1, Enrici Vaion, R.1, riccardo.enricivaion@st.com, Mervic, A.1, Testa, S.1
Source: Microelectronics Reliability; Aug2015, Vol. 55 Issue 9/10, p1838-1842, 5p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 110216210
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=110216210
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.microrel.2015.06.150
    Languages:
      – Code: eng
        Text: English
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      Pagination:
        PageCount: 5
        StartPage: 1838
    Titles:
      – TitleFull: Metal fatigue in copper pillar Flip Chip BGA: A refined acceleration model for the aluminium pad cracking failure mechanism.
        Type: main
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            NameFull: Alberti, R.
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            NameFull: Enrici Vaion, R.
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            NameFull: Mervic, A.
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            NameFull: Testa, S.
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            – D: 01
              M: 08
              Text: Aug2015
              Type: published
              Y: 2015
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              Value: 00262714
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              Value: 55
            – Type: issue
              Value: 9/10
          Titles:
            – TitleFull: Microelectronics Reliability
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