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Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints.

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Title: Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints.
Authors: Tao, Yeqing1, Ding, Dongyan1, dyding@sjtu.edu.cn, Li, Ting1, Guo, Jason2, Yu, Yunhong2
Source: Journal of Materials Science: Materials in Electronics; May2016, Vol. 27 Issue 5, p4898-4907, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 117359552
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Tao%2C+Yeqing%22">Tao, Yeqing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ding%2C+Dongyan%22">Ding, Dongyan</searchLink><relatesTo>1</relatesTo>, <i>dyding@sjtu.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Li%2C+Ting%22">Li, Ting</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Guo%2C+Jason%22">Guo, Jason</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Yu%2C+Yunhong%22">Yu, Yunhong</searchLink><relatesTo>2</relatesTo>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; May2016, Vol. 27 Issue 5, p4898-4907, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=117359552
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-016-4373-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 10
        StartPage: 4898
    Titles:
      – TitleFull: Influence of protective atmosphere on the solderability and reliability of OSP-based solder joints.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Tao, Yeqing
      – PersonEntity:
          Name:
            NameFull: Ding, Dongyan
      – PersonEntity:
          Name:
            NameFull: Li, Ting
      – PersonEntity:
          Name:
            NameFull: Guo, Jason
      – PersonEntity:
          Name:
            NameFull: Yu, Yunhong
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 05
              Text: May2016
              Type: published
              Y: 2016
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 27
            – Type: issue
              Value: 5
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1