Tedjini, M., Fournel, F., Moriceau, H., Larrey, V., Landru, D., Kononchuk, O., . . . Rieutord, F. (2016). Interface water diffusion in silicon direct bonding. Applied Physics Letters, 109(11), 111603-1. https://doi.org/10.1063/1.4962464
Chicago Style (17th ed.) CitationTedjini, M., F. Fournel, H. Moriceau, V. Larrey, D. Landru, O. Kononchuk, S. Tardif, and F. Rieutord. "Interface Water Diffusion in Silicon Direct Bonding." Applied Physics Letters 109, no. 11 (2016): 111603-1. https://doi.org/10.1063/1.4962464.
MLA (9th ed.) CitationTedjini, M., et al. "Interface Water Diffusion in Silicon Direct Bonding." Applied Physics Letters, vol. 109, no. 11, 2016, pp. 111603-1, https://doi.org/10.1063/1.4962464.
Warning: These citations may not always be 100% accurate.