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Interface water diffusion in silicon direct bonding.

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Title: Interface water diffusion in silicon direct bonding.
Authors: Tedjini, M.1, Fournel, F.1, Moriceau, H.1, Larrey, V.1, Landru, D.2, Kononchuk, O.2, Tardif, S.3, Rieutord, F.3
Source: Applied Physics Letters; 9/12/2016, Vol. 109 Issue 11, p111603-1-111603-3, 3p, 1 Black and White Photograph, 1 Diagram, 4 Graphs
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 118199452
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: <searchLink fieldCode="JN" term="%22Applied+Physics+Letters%22">Applied Physics Letters</searchLink>; 9/12/2016, Vol. 109 Issue 11, p111603-1-111603-3, 3p, 1 Black and White Photograph, 1 Diagram, 4 Graphs
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=118199452
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      – Type: doi
        Value: 10.1063/1.4962464
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      – Code: eng
        Text: English
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        StartPage: 111603-1
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      – TitleFull: Interface water diffusion in silicon direct bonding.
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            NameFull: Tedjini, M.
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            NameFull: Fournel, F.
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              M: 09
              Text: 9/12/2016
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