APA (7th ed.) Citation

Magnien, J., Mitterhuber, L., Rosc, J., Schrank, F., Hörth, S., Goullon, L., . . . Kraker, E. (2017). Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation. Microelectronics Reliability, 76, 601. https://doi.org/10.1016/j.microrel.2017.07.052

Chicago Style (17th ed.) Citation

Magnien, J., L. Mitterhuber, J. Rosc, F. Schrank, S. Hörth, L. Goullon, M. Hutter, S. Defregger, and E. Kraker. "Reliability and Failure Analysis of Solder Joints in Flip Chip LEDs via Thermal Impedance Characterisation." Microelectronics Reliability 76 (2017): 601. https://doi.org/10.1016/j.microrel.2017.07.052.

MLA (9th ed.) Citation

Magnien, J., et al. "Reliability and Failure Analysis of Solder Joints in Flip Chip LEDs via Thermal Impedance Characterisation." Microelectronics Reliability, vol. 76, 2017, p. 601, https://doi.org/10.1016/j.microrel.2017.07.052.