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Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.

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Title: Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
Authors: Magnien, J.1, julien.magnien@mcl.at, Mitterhuber, L.1, Rosc, J.1, Schrank, F.2, Hörth, S.3, Goullon, L.4, Hutter, M.4, Defregger, S.1, Kraker, E.1
Source: Microelectronics Reliability; Sep2017, Vol. 76, p601-605, 5p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 125255532
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=125255532
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1016/j.microrel.2017.07.052
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      – Code: eng
        Text: English
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        PageCount: 5
        StartPage: 601
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      – TitleFull: Reliability and failure analysis of solder joints in flip chip LEDs via thermal impedance characterisation.
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            – D: 01
              M: 09
              Text: Sep2017
              Type: published
              Y: 2017
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              Value: 76
          Titles:
            – TitleFull: Microelectronics Reliability
              Type: main
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