APA (7th ed.) Citation

Xia, H., Guo, R., Yan, F., & Cheng, H. (2018). Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry. Advances in Materials Science & Engineering, 1. https://doi.org/10.1155/2018/1954573

Chicago Style (17th ed.) Citation

Xia, Haiting, Rongxin Guo, Feng Yan, and Heming Cheng. "Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry." Advances in Materials Science & Engineering 2018: 1. https://doi.org/10.1155/2018/1954573.

MLA (9th ed.) Citation

Xia, Haiting, et al. "Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry." Advances in Materials Science & Engineering, 2018, p. 1, https://doi.org/10.1155/2018/1954573.