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Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry.

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Bibliographic Details
Title: Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry.
Authors: Xia, Haiting1,2, Guo, Rongxin1,2, Yan, Feng1,2, Cheng, Heming1
Source: Advances in Materials Science & Engineering; 5/16/2017, p1-8, 8p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 129637040
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PubType: Academic Journal
PubTypeId: academicJournal
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RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1155/2018/1954573
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      – Code: eng
        Text: English
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        PageCount: 8
        StartPage: 1
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      – TitleFull: Real-Time and Quantitative Measurement of Crack-Tip Stress Intensity Factors Using Digital Holographic Interferometry.
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            NameFull: Xia, Haiting
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            NameFull: Guo, Rongxin
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            NameFull: Yan, Feng
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            NameFull: Cheng, Heming
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            – D: 16
              M: 05
              Text: 5/16/2017
              Type: published
              Y: 2018
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              Value: 16878434
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            – TitleFull: Advances in Materials Science & Engineering
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