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Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes.

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Bibliographic Details
Title: Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes.
Authors: Shang, Andrew W.1, Lo, Jeffery C. C.1, Lee, Ricky S. W.1, rickylee@ust.hk
Source: IEEE Transactions on Components, Packaging & Manufacturing Technology; Mar2019, Vol. 9 Issue 3, p562-566, 5p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 135356259
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes.
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=135356259
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1109/TCPMT.2018.2869641
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 5
        StartPage: 562
    Titles:
      – TitleFull: Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes.
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            NameFull: Shang, Andrew W.
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            NameFull: Lo, Jeffery C. C.
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            NameFull: Lee, Ricky S. W.
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              Text: Mar2019
              Type: published
              Y: 2019
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              Value: 9
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              Value: 3
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            – TitleFull: IEEE Transactions on Components, Packaging & Manufacturing Technology
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