APA (7th ed.) Citation

Zhang, D., Xu, J., Mao, S., Zhao, C., Wang, G., Luo, X., . . . Luo, J. (2019). Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping. Journal of Materials Science: Materials in Electronics, 30(11), 10579. https://doi.org/10.1007/s10854-019-01402-0

Chicago Style (17th ed.) Citation

Zhang, Dan, et al. "Co-sputtering Co–Ti Alloy as a Single Barrier/liner for Co Interconnects and Thermal Stability Enhancement Using TiN Metal Capping." Journal of Materials Science: Materials in Electronics 30, no. 11 (2019): 10579. https://doi.org/10.1007/s10854-019-01402-0.

MLA (9th ed.) Citation

Zhang, Dan, et al. "Co-sputtering Co–Ti Alloy as a Single Barrier/liner for Co Interconnects and Thermal Stability Enhancement Using TiN Metal Capping." Journal of Materials Science: Materials in Electronics, vol. 30, no. 11, 2019, p. 10579, https://doi.org/10.1007/s10854-019-01402-0.