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Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping.

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Title: Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping.
Authors: Zhang, Dan1,2, Xu, Jing1, Mao, Shujuan1,2, Zhao, Chao1,2, zhaochao@ime.ac.cn, Wang, Guilei1, Luo, Xue1,2, Li, Junfeng1, Li, Yongliang1, Wang, Wenwu1,2, Chen, Dapeng1, Ye, Tianchun1,2, Luo, Jun1,2, luojun@ime.ac.cn
Source: Journal of Materials Science: Materials in Electronics; Jun2019, Vol. 30 Issue 11, p10579-10588, 10p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 136694397
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PubTypeId: academicJournal
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Zhang%2C+Dan%22">Zhang, Dan</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Xu%2C+Jing%22">Xu, Jing</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Mao%2C+Shujuan%22">Mao, Shujuan</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhao%2C+Chao%22">Zhao, Chao</searchLink><relatesTo>1,2</relatesTo>, <i>zhaochao@ime.ac.cn</i><br /><searchLink fieldCode="AU" term="%22Wang%2C+Guilei%22">Wang, Guilei</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Luo%2C+Xue%22">Luo, Xue</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Junfeng%22">Li, Junfeng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Li%2C+Yongliang%22">Li, Yongliang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Wang%2C+Wenwu%22">Wang, Wenwu</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Dapeng%22">Chen, Dapeng</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Ye%2C+Tianchun%22">Ye, Tianchun</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Luo%2C+Jun%22">Luo, Jun</searchLink><relatesTo>1,2</relatesTo>, <i>luojun@ime.ac.cn</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2019, Vol. 30 Issue 11, p10579-10588, 10p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=136694397
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1007/s10854-019-01402-0
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 10
        StartPage: 10579
    Titles:
      – TitleFull: Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Zhang, Dan
      – PersonEntity:
          Name:
            NameFull: Xu, Jing
      – PersonEntity:
          Name:
            NameFull: Mao, Shujuan
      – PersonEntity:
          Name:
            NameFull: Zhao, Chao
      – PersonEntity:
          Name:
            NameFull: Wang, Guilei
      – PersonEntity:
          Name:
            NameFull: Luo, Xue
      – PersonEntity:
          Name:
            NameFull: Li, Junfeng
      – PersonEntity:
          Name:
            NameFull: Li, Yongliang
      – PersonEntity:
          Name:
            NameFull: Wang, Wenwu
      – PersonEntity:
          Name:
            NameFull: Chen, Dapeng
      – PersonEntity:
          Name:
            NameFull: Ye, Tianchun
      – PersonEntity:
          Name:
            NameFull: Luo, Jun
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 06
              Text: Jun2019
              Type: published
              Y: 2019
          Identifiers:
            – Type: issn-print
              Value: 09574522
          Numbering:
            – Type: volume
              Value: 30
            – Type: issue
              Value: 11
          Titles:
            – TitleFull: Journal of Materials Science: Materials in Electronics
              Type: main
ResultId 1