Co-sputtering Co–Ti alloy as a single barrier/liner for Co interconnects and thermal stability enhancement using TiN metal capping. - Zhang, Dan; Xu, Jing; Mao, Shujuan; Zhao, Chao; Wang, Guilei; Luo, Xue; Li, Junfeng; Li, Yongliang; Wang, Wenwu; Chen, Dapeng; Ye, Tianchun; Luo, Jun (Journal of Materials Science: Materials in Electronics, 2019)