APA (7th ed.) Citation

Niu, X., Chen, C., Shen, L., Chen, L., & Zhou, J. (2019). Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings. Journal of Materials Science: Materials in Electronics, 30(20), 18678. https://doi.org/10.1007/s10854-019-02220-0

Chicago Style (17th ed.) Citation

Niu, Xiaoyan, Cong Chen, Linlin Shen, Liangbiao Chen, and Jiang Zhou. "Experimental and Numerical Study on Dynamic Mechanical Behaviors of Low-silver Lead-free Solder Under Combined Compression-shear Loadings." Journal of Materials Science: Materials in Electronics 30, no. 20 (2019): 18678. https://doi.org/10.1007/s10854-019-02220-0.

MLA (9th ed.) Citation

Niu, Xiaoyan, et al. "Experimental and Numerical Study on Dynamic Mechanical Behaviors of Low-silver Lead-free Solder Under Combined Compression-shear Loadings." Journal of Materials Science: Materials in Electronics, vol. 30, no. 20, 2019, p. 18678, https://doi.org/10.1007/s10854-019-02220-0.