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Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings.

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Title: Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings.
Authors: Niu, Xiaoyan1, niu-xiaoyan2002@163.com, Chen, Cong1, Shen, Linlin1, Chen, Liangbiao2, Zhou, Jiang2
Source: Journal of Materials Science: Materials in Electronics; Oct2019, Vol. 30 Issue 20, p18678-18685, 8p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 139163963
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings.
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  Data: <searchLink fieldCode="AU" term="%22Niu%2C+Xiaoyan%22">Niu, Xiaoyan</searchLink><relatesTo>1</relatesTo>, <i>niu-xiaoyan2002@163.com</i><br /><searchLink fieldCode="AU" term="%22Chen%2C+Cong%22">Chen, Cong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Shen%2C+Linlin%22">Shen, Linlin</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chen%2C+Liangbiao%22">Chen, Liangbiao</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Zhou%2C+Jiang%22">Zhou, Jiang</searchLink><relatesTo>2</relatesTo>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Oct2019, Vol. 30 Issue 20, p18678-18685, 8p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=139163963
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-019-02220-0
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      – Code: eng
        Text: English
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        PageCount: 8
        StartPage: 18678
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      – TitleFull: Experimental and numerical study on dynamic mechanical behaviors of low-silver lead-free solder under combined compression-shear loadings.
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            NameFull: Niu, Xiaoyan
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            NameFull: Chen, Cong
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            NameFull: Shen, Linlin
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            NameFull: Chen, Liangbiao
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            NameFull: Zhou, Jiang
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            – D: 15
              M: 10
              Text: Oct2019
              Type: published
              Y: 2019
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              Value: 09574522
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              Value: 30
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              Value: 20
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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