APA (7th ed.) Citation

Nguyen, Q., Tefashe, U., Martin, P., Della Rocca, M. L., Lafolet, F., Lafarge, P., . . . Lacroix, J. (2020). Molecular Signature and Activationless Transport in Cobalt‐Terpyridine‐Based Molecular Junctions. Advanced Electronic Materials, 6(7), 1. https://doi.org/10.1002/aelm.201901416

Chicago Style (17th ed.) Citation

Nguyen, Quyen, Ushula Tefashe, Pascal Martin, Maria Luisa Della Rocca, Frederic Lafolet, Philippe Lafarge, Richard L. McCreery, and Jean‐Christophe Lacroix. "Molecular Signature and Activationless Transport in Cobalt‐Terpyridine‐Based Molecular Junctions." Advanced Electronic Materials 6, no. 7 (2020): 1. https://doi.org/10.1002/aelm.201901416.

MLA (9th ed.) Citation

Nguyen, Quyen, et al. "Molecular Signature and Activationless Transport in Cobalt‐Terpyridine‐Based Molecular Junctions." Advanced Electronic Materials, vol. 6, no. 7, 2020, p. 1, https://doi.org/10.1002/aelm.201901416.