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Molecular Signature and Activationless Transport in Cobalt‐Terpyridine‐Based Molecular Junctions.

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Title: Molecular Signature and Activationless Transport in Cobalt‐Terpyridine‐Based Molecular Junctions.
Authors: Nguyen, Quyen1,2, Tefashe, Ushula3, Martin, Pascal1, martin@univ-paris-diderot.fr, Della Rocca, Maria Luisa4, Lafolet, Frederic1, Lafarge, Philippe4, McCreery, Richard L.3, Lacroix, Jean‐Christophe1, lacroix@univ-paris-diderot.fr
Source: Advanced Electronic Materials; Jul2020, Vol. 6 Issue 7, p1-11, 11p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 144544346
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Molecular Signature and Activationless Transport in Cobalt‐Terpyridine‐Based Molecular Junctions.
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  Data: <searchLink fieldCode="JN" term="%22Advanced+Electronic+Materials%22">Advanced Electronic Materials</searchLink>; Jul2020, Vol. 6 Issue 7, p1-11, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=144544346
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1002/aelm.201901416
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 1
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      – TitleFull: Molecular Signature and Activationless Transport in Cobalt‐Terpyridine‐Based Molecular Junctions.
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            NameFull: Nguyen, Quyen
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            NameFull: Tefashe, Ushula
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            NameFull: Martin, Pascal
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            NameFull: Della Rocca, Maria Luisa
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            NameFull: Lafolet, Frederic
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            NameFull: Lafarge, Philippe
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            – D: 01
              M: 07
              Text: Jul2020
              Type: published
              Y: 2020
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              Value: 7
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            – TitleFull: Advanced Electronic Materials
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