Nanometer-thin pure boron CVD layers as material barrier to Au or Cu metallization of Si.
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| Title: | Nanometer-thin pure boron CVD layers as material barrier to Au or Cu metallization of Si. |
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| Authors: | Shivakumar, D. Thammaiah1,2, Knežević, Tihomir2,3, Nanver, Lis K.1,2, l.k.nanver@utwente.nl |
| Source: | Journal of Materials Science: Materials in Electronics; Mar2021, Vol. 32 Issue 6, p7123-7135, 13p |
| Database: | Applied Science & Technology Source |
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