APA (7th ed.) Citation

Hwang, Y., Pan, C., Chen, B., Jian, S., & Kik, T. (2021). Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps. Metals (2075-4701), 11(3), 460. https://doi.org/10.3390/met11030460

Chicago Style (17th ed.) Citation

Hwang, Yeong-Maw, Cheng-Tang Pan, Bo-Syun Chen, Sheng-Rui Jian, and Tomasz Kik. "Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps." Metals (2075-4701) 11, no. 3 (2021): 460. https://doi.org/10.3390/met11030460.

MLA (9th ed.) Citation

Hwang, Yeong-Maw, et al. "Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps." Metals (2075-4701), vol. 11, no. 3, 2021, p. 460, https://doi.org/10.3390/met11030460.