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Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps.

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Title: Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps.
Authors: Hwang, Yeong-Maw1, ymhwang@mail.nsysu.edu.tw, Pan, Cheng-Tang1, pan@mem.nsysu.edu.tw, Chen, Bo-Syun1, bosyun815@gmail.com, Jian, Sheng-Rui2,3, srjian@gmail.com, Kik, Tomasz
Source: Metals (2075-4701); Mar2021, Vol. 11 Issue 3, p460-460, 1p
Database: Applied Science & Technology Source
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  Data: <searchLink fieldCode="JN" term="%22Metals+%282075-4701%29%22">Metals (2075-4701)</searchLink>; Mar2021, Vol. 11 Issue 3, p460-460, 1p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=149557134
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        Value: 10.3390/met11030460
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        Text: English
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              Text: Mar2021
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              Y: 2021
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