Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps.
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| Title: | Numerical Analysis of the Welding Behaviors in Micro-Copper Bumps. |
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| Authors: | Hwang, Yeong-Maw1, ymhwang@mail.nsysu.edu.tw, Pan, Cheng-Tang1, pan@mem.nsysu.edu.tw, Chen, Bo-Syun1, bosyun815@gmail.com, Jian, Sheng-Rui2,3, srjian@gmail.com, Kik, Tomasz |
| Source: | Metals (2075-4701); Mar2021, Vol. 11 Issue 3, p460-460, 1p |
| Database: | Applied Science & Technology Source |
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