APA (7th ed.) Citation

Huang, Y., Fu, R., Chen, X., Cheng, B., & Agathopoulos, S. (2021). Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil. Journal of Materials Science: Materials in Electronics, 32(12), 15826. https://doi.org/10.1007/s10854-021-06135-7

Chicago Style (17th ed.) Citation

Huang, Yilian, Renli Fu, Xudong Chen, Bo Cheng, and Simeon Agathopoulos. "Interfacial Strength and Microstructure of AlN/Cu Joints Produced by a Novel Brazing Method Facilitated by Porous Copper Layer and Ag Foil." Journal of Materials Science: Materials in Electronics 32, no. 12 (2021): 15826. https://doi.org/10.1007/s10854-021-06135-7.

MLA (9th ed.) Citation

Huang, Yilian, et al. "Interfacial Strength and Microstructure of AlN/Cu Joints Produced by a Novel Brazing Method Facilitated by Porous Copper Layer and Ag Foil." Journal of Materials Science: Materials in Electronics, vol. 32, no. 12, 2021, p. 15826, https://doi.org/10.1007/s10854-021-06135-7.