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Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil.

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Title: Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil.
Authors: Huang, Yilian1, Fu, Renli1, renlifu@nuaa.edu.cn, Chen, Xudong1, Cheng, Bo1, Agathopoulos, Simeon2, sagat@uoi.gr
Source: Journal of Materials Science: Materials in Electronics; Jun2021, Vol. 32 Issue 12, p15826-15836, 11p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 151103928
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil.
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  Data: <searchLink fieldCode="AU" term="%22Huang%2C+Yilian%22">Huang, Yilian</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Fu%2C+Renli%22">Fu, Renli</searchLink><relatesTo>1</relatesTo>, <i>renlifu@nuaa.edu.cn</i><br /><searchLink fieldCode="AU" term="%22Chen%2C+Xudong%22">Chen, Xudong</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Cheng%2C+Bo%22">Cheng, Bo</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Agathopoulos%2C+Simeon%22">Agathopoulos, Simeon</searchLink><relatesTo>2</relatesTo>, <i>sagat@uoi.gr</i>
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  Data: <searchLink fieldCode="JN" term="%22Journal+of+Materials+Science%3A+Materials+in+Electronics%22">Journal of Materials Science: Materials in Electronics</searchLink>; Jun2021, Vol. 32 Issue 12, p15826-15836, 11p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=151103928
RecordInfo BibRecord:
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      – Type: doi
        Value: 10.1007/s10854-021-06135-7
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      – Code: eng
        Text: English
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        PageCount: 11
        StartPage: 15826
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      – TitleFull: Interfacial strength and microstructure of AlN/Cu joints produced by a novel brazing method facilitated by porous copper layer and Ag foil.
        Type: main
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      – PersonEntity:
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            NameFull: Huang, Yilian
      – PersonEntity:
          Name:
            NameFull: Fu, Renli
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            NameFull: Chen, Xudong
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            NameFull: Cheng, Bo
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            NameFull: Agathopoulos, Simeon
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          Dates:
            – D: 15
              M: 06
              Text: Jun2021
              Type: published
              Y: 2021
          Identifiers:
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              Value: 09574522
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              Value: 32
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              Value: 12
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            – TitleFull: Journal of Materials Science: Materials in Electronics
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