APA (7th ed.) Citation

Lee, C., Cho, H., & Lee, D. (2021). The mechanism of innovation spill-over across sub-layers in the ICT industry. Asian Journal of Technology Innovation, 29(2), 159. https://doi.org/10.1080/19761597.2020.1796725

Chicago Style (17th ed.) Citation

Lee, Changjun, Hosoo Cho, and Daeho Lee. "The Mechanism of Innovation Spill-over Across Sub-layers in the ICT Industry." Asian Journal of Technology Innovation 29, no. 2 (2021): 159. https://doi.org/10.1080/19761597.2020.1796725.

MLA (9th ed.) Citation

Lee, Changjun, et al. "The Mechanism of Innovation Spill-over Across Sub-layers in the ICT Industry." Asian Journal of Technology Innovation, vol. 29, no. 2, 2021, p. 159, https://doi.org/10.1080/19761597.2020.1796725.