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The mechanism of innovation spill-over across sub-layers in the ICT industry.

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Title: The mechanism of innovation spill-over across sub-layers in the ICT industry.
Authors: Lee, Changjun1, Cho, Hosoo2, Lee, Daeho3, daeho.lee@skku.edu
Source: Asian Journal of Technology Innovation; Aug2021, Vol. 29 Issue 2, p159-179, 21p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 151722379
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: The mechanism of innovation spill-over across sub-layers in the ICT industry.
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  Data: <searchLink fieldCode="AU" term="%22Lee%2C+Changjun%22">Lee, Changjun</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Cho%2C+Hosoo%22">Cho, Hosoo</searchLink><relatesTo>2</relatesTo><br /><searchLink fieldCode="AU" term="%22Lee%2C+Daeho%22">Lee, Daeho</searchLink><relatesTo>3</relatesTo>, <i>daeho.lee@skku.edu</i>
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  Data: <searchLink fieldCode="JN" term="%22Asian+Journal+of+Technology+Innovation%22">Asian Journal of Technology Innovation</searchLink>; Aug2021, Vol. 29 Issue 2, p159-179, 21p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=151722379
RecordInfo BibRecord:
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    Identifiers:
      – Type: doi
        Value: 10.1080/19761597.2020.1796725
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 21
        StartPage: 159
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      – TitleFull: The mechanism of innovation spill-over across sub-layers in the ICT industry.
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            NameFull: Lee, Changjun
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            NameFull: Cho, Hosoo
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            NameFull: Lee, Daeho
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            – D: 01
              M: 08
              Text: Aug2021
              Type: published
              Y: 2021
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              Value: 29
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              Value: 2
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            – TitleFull: Asian Journal of Technology Innovation
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