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The mechanism of innovation spill-over across sub-layers in the ICT industry.

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Bibliographic Details
Title: The mechanism of innovation spill-over across sub-layers in the ICT industry.
Authors: Lee, Changjun1, Cho, Hosoo2, Lee, Daeho3, daeho.lee@skku.edu
Source: Asian Journal of Technology Innovation; Aug2021, Vol. 29 Issue 2, p159-179, 21p
Database: Applied Science & Technology Source
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