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Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.

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Title: Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
Authors: Sharma, Ved Prakash1,2, Datla, Naresh Varma1, datla@mech.iitd.ac.in
Source: Microelectronics Reliability; Dec2021, Vol. 127, pN.PAG-N.PAG, 1p
Database: Applied Science & Technology Source
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  Availability: 0
Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 153681007
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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  Data: Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
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  Data: <searchLink fieldCode="AU" term="%22Sharma%2C+Ved+Prakash%22">Sharma, Ved Prakash</searchLink><relatesTo>1,2</relatesTo><br /><searchLink fieldCode="AU" term="%22Datla%2C+Naresh+Varma%22">Datla, Naresh Varma</searchLink><relatesTo>1</relatesTo>, <i>datla@mech.iitd.ac.in</i>
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PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=153681007
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.1016/j.microrel.2021.114381
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      – Code: eng
        Text: English
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        PageCount: 1
        StartPage: N.PAG
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      – TitleFull: Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints.
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            NameFull: Sharma, Ved Prakash
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            NameFull: Datla, Naresh Varma
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            – D: 01
              M: 12
              Text: Dec2021
              Type: published
              Y: 2021
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              Value: 127
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