APA (7th ed.) Citation

Laksono, A. D., Tsai, T., Chung, T., Chang, Y., & Yen, Y. (2023). Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates. Metals (2075-4701), 13(1), 12. https://doi.org/10.3390/met13010012

Chicago Style (17th ed.) Citation

Laksono, Andromeda Dwi, Tzu-Yang Tsai, Tai-Hsuan Chung, Yong-Chi Chang, and Yee-Wen Yen. "Investigation of the Sn-0.7 Wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates." Metals (2075-4701) 13, no. 1 (2023): 12. https://doi.org/10.3390/met13010012.

MLA (9th ed.) Citation

Laksono, Andromeda Dwi, et al. "Investigation of the Sn-0.7 Wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates." Metals (2075-4701), vol. 13, no. 1, 2023, p. 12, https://doi.org/10.3390/met13010012.