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Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates.

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Title: Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates.
Authors: Laksono, Andromeda Dwi1, Tsai, Tzu-Yang1, Chung, Tai-Hsuan1, Chang, Yong-Chi1, Yen, Yee-Wen1, ywyen@mail.ntust.edu.tw
Source: Metals (2075-4701); Jan2023, Vol. 13 Issue 1, p12, 16p
Database: Applied Science & Technology Source
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Header DbId: aci
DbLabel: Applied Science & Technology Source
An: 161564219
AccessLevel: 2
PubType: Academic Journal
PubTypeId: academicJournal
PreciseRelevancyScore: 0
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AU" term="%22Laksono%2C+Andromeda+Dwi%22">Laksono, Andromeda Dwi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Tsai%2C+Tzu-Yang%22">Tsai, Tzu-Yang</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chung%2C+Tai-Hsuan%22">Chung, Tai-Hsuan</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Chang%2C+Yong-Chi%22">Chang, Yong-Chi</searchLink><relatesTo>1</relatesTo><br /><searchLink fieldCode="AU" term="%22Yen%2C+Yee-Wen%22">Yen, Yee-Wen</searchLink><relatesTo>1</relatesTo>, <i>ywyen@mail.ntust.edu.tw</i>
– Name: TitleSource
  Label: Source
  Group: Src
  Data: <searchLink fieldCode="JN" term="%22Metals+%282075-4701%29%22">Metals (2075-4701)</searchLink>; Jan2023, Vol. 13 Issue 1, p12, 16p
PLink https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&db=aci&AN=161564219
RecordInfo BibRecord:
  BibEntity:
    Identifiers:
      – Type: doi
        Value: 10.3390/met13010012
    Languages:
      – Code: eng
        Text: English
    PhysicalDescription:
      Pagination:
        PageCount: 16
        StartPage: 12
    Titles:
      – TitleFull: Investigation of the Sn-0.7 wt.% Cu Solder Reacting with C194, Alloy 25, and C1990 HP Substrates.
        Type: main
  BibRelationships:
    HasContributorRelationships:
      – PersonEntity:
          Name:
            NameFull: Laksono, Andromeda Dwi
      – PersonEntity:
          Name:
            NameFull: Tsai, Tzu-Yang
      – PersonEntity:
          Name:
            NameFull: Chung, Tai-Hsuan
      – PersonEntity:
          Name:
            NameFull: Chang, Yong-Chi
      – PersonEntity:
          Name:
            NameFull: Yen, Yee-Wen
    IsPartOfRelationships:
      – BibEntity:
          Dates:
            – D: 01
              M: 01
              Text: Jan2023
              Type: published
              Y: 2023
          Identifiers:
            – Type: issn-print
              Value: 20754701
          Numbering:
            – Type: volume
              Value: 13
            – Type: issue
              Value: 1
          Titles:
            – TitleFull: Metals (2075-4701)
              Type: main
ResultId 1